Semiconductor Memory Thermal Management via Composite Tube
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Solution Overview
Problem
Semiconductor memory devices, such as USB drives, face challenges in efficiently dissipating heat generated by the controller and flash memory, leading to potential thermal insulation issues and reduced cooling efficiency.
Innovation Solution
A first layer with higher thermal conductivity than the device's material is interposed between the substrate and the inner face of the tube, facilitating heat conduction to the host device through a connector, thereby enhancing cooling efficiency while reinforcing the device's structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a tube made of low thermal conductivity material is used for the connector, then the device structure is reinforced and appearance is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent applies composite materials by combining a metal layer (high thermal conductivity) with a resin layer (structural reinforcement and aesthetic properties) to form a tube connector. The metal layer conducts heat away from the semiconductor memory device, while the resin layer provides structural strength and maintains appearance, thus resolving the contradiction between heat dissipation efficiency and structural strength.
2Strength
If the tube wall thickness is increased to reinforce structure, then device strength improves, but heat conduction capability deteriorates
Solution Approach 1:
The patent uses a composite structure with a metal layer and resin layer where the metal layer (even with thin wall thickness) provides sufficient heat conduction capability, while the combined structure maintains structural strength. This resolves the contradiction by allowing thin-walled construction without sacrificing either heat conduction or strength.
3Temperature
If a metal connector is used for heat conduction, then cooling efficiency improves, but device appearance and corrosion resistance deteriorate
Solution Approach 1:
The patent combines a metal layer (providing heat conduction and corrosion resistance) with a resin layer (providing aesthetic appearance and sleek finish). The metal layer conducts heat away from the device while the resin layer provides the desired appearance, thus resolving the contradiction between cooling efficiency and appearance.
4Shape
If the tube is made thinner to maintain sleek appearance, then device aesthetics improve, but structural strength and heat conduction deteriorate
Solution Approach 1:
The patent uses a composite tube structure where the combination of metal and resin layers provides sufficient structural strength even with thin overall wall thickness. The metal layer contributes to strength and heat conduction, while the resin layer provides aesthetic appearance, allowing thin-walled construction that maintains both strength and appearance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools the semiconductor memory device by conducting heat generated from the controller to the host device, improving cooling efficiency and preventing damage to the device's structure, while maintaining a sleek appearance.
Implementation Method 1
a first layer which covers at least a portion of an inner face of the first tube, is interposed between the first portion and the first tube, and has a thermal conductivity higher than a thermal conductivity of the first tube
Data Source
AI summary
According to one embodiment, a semiconductor memory device includes a first tube, a case, a substrate, a memory, a controller, and a first layer. The case is connected to the first tube. The substrate includes a first portion inside the first tube. The first layer covers an inner face of the first tube, is interposed between the first portion and the first tube, and has a thermal conductivity higher than a thermal conductivity of the first tube.