Semiconductor Connecting Elements with Mesa Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor component housing constructions, such as die bonding and wire bonding, limit miniaturization due to thickness constraints and reliability issues like embrittlement from nickel-based coatings, and require additional space for thermal stress compensation, making it difficult to achieve dimensions below half a millimeter for discrete semiconductor components.
Innovation Solution
A semiconductor component with mesa or mushroom-shaped connecting elements and a structured nickel- and lead-free contact coating, integrated into a plastic housing composition, allowing for surface mounting and reducing the need for external wiring, while providing a solderable and thermally stable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If die bonding and wire bonding processes are used, then semiconductor chips can be mounted on carriers, but the housing height and lateral dimensions cannot be reduced below certain limits due to contact pad thickness, bonding wire loop height, and tolerance requirements
Solution Approach 1:
The invention extracts and eliminates the bonding wire loop and contact pad structures from the mounting process. Instead of using wire bonding with thick contact pads, the patent uses direct surface-mountable connecting elements that are integrated into the semiconductor chip housing, removing the need for separate bonding wires and reducing overall housing height.
Solution Approach 2:
The invention transitions from three-dimensional wire loop bonding to a planar surface-mount configuration. The connecting elements are arranged coplanarly on the semiconductor chip surface, eliminating the vertical height component of wire loops and enabling reduced housing dimensions in all three spatial dimensions.
2Length of moving object
If wire bonding is used for discrete semiconductor components, then electrical connections can be established, but lateral dimensions cannot be reduced below half a millimeter due to wire bonding tolerances and bonding wire length tolerances
Solution Approach 1:
The invention replaces the mechanical wire bonding process with a surface-mount technology approach. Instead of mechanically attaching wires with tight tolerance requirements, the patent uses solderable connecting elements that can be mounted using standard surface-mount techniques, which are more tolerant and enable smaller dimensions.
3Reliability
If electroless chemical deposition of NiAu is used for TSLP housings, then contact areas can be provided, but nickel tends to form brittle phases causing embrittlement and reliability problems
Solution Approach 1:
The invention changes the material composition parameters of the contact coating. Instead of using nickel-based alloys that form brittle phases, the patent employs lead-free and nickel-free solderable coatings such as tin-silver-gold compositions, which eliminate embrittlement while maintaining solderability and electrical conductivity.
4Reliability
If surface-mountable BGA housings are used, then connections can be made to superordinate circuit carriers, but additional space is required for wiring substrates and underfill materials to compensate for thermal stresses
Solution Approach 1:
The invention merges the functions of the semiconductor chip housing, connecting elements, and thermal stress compensation into a single integrated structure. The plastic housing composition directly encapsulates the semiconductor chip and provides both mechanical support and thermal stress management, eliminating the need for separate underfill materials and wiring substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective mass production of discrete semiconductor components with reduced dimensions, improved reliability, and environmental compatibility by eliminating nickel-related embrittlement and reducing thermal stress effects, without the need for underfill coatings or complex wiring.
Implementation Method 1
The connecting element (6) includes a structured nickel- and lead-free contact coating
Implementation Method 2
the requirement for wiring substrates and underfill materials which have to compensate for and fill the distance to superordinate circuit carriers in order to reduce thermal stresses
Data Source
AI summary
A semiconductor component with connecting elements between a semiconductor chip made from a semiconductor wafer with discrete semiconductor components and a superordinate circuit carrier is disclosed. The semiconductor component has a coplanar area having top sides of the connecting elements and a plastic housing composition. The connecting element has a mesa structure or a mushroom-shaped form for surface mounting. Moreover, the connecting element includes a structured nickel- and lead-free contact coating. The connecting element is arranged on contact areas of the semiconductor chip, the areal extent of the connecting elements corresponding to the contact areas of the semiconductor chip.