3D Semiconductor Mesh Network for Redundant Die Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Next-generation data centers and IoT devices face challenges in meeting demands for increased bandwidth, power efficiency, and flexibility due to limitations in current semiconductor packaging solutions, such as chip-to-chip bandwidth limitations and increased physical size of printed circuit boards.
Innovation Solution
A semiconductor package with a three-dimensional electrical mesh network that conductively couples multiple small semiconductor dies to a base die, providing redundancy and improved communication speed while reducing power consumption through a multi-layer conductive network with orthogonal and diagonal conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional components are packed on a standard printed circuit board to meet increased bandwidth and functionality demands, then system functionality is improved, but chip-to-chip bandwidth limitations and power demand increase
Solution Approach 1:
The patent transitions from a two-dimensional PCB layout to a three-dimensional stacked architecture where semiconductor dies are vertically arranged and interconnected through through-silicon vias (TSVs). This vertical integration dramatically reduces the physical distance between components, enabling higher bandwidth communication while reducing power consumption associated with long-distance signal transmission on PCBs.
Solution Approach 2:
The system is divided into multiple independent semiconductor dies that can be separately fabricated, tested, and then stacked together. Each die can be optimized for specific functions (e.g., logic, memory, I/O), allowing independent evolution of different components while maintaining high-speed interconnections through the stacked architecture.
2Adaptability or versatility
If additional components are packed on a standard printed circuit board to meet increased bandwidth demands, then system functionality is improved, but the physical size of printed circuit boards increases
Solution Approach 1:
By stacking semiconductor dies vertically and connecting them through TSVs, the patent consolidates multiple components into a compact three-dimensional structure. This approach reduces the horizontal footprint on the PCB while maintaining or enhancing system functionality, as components are arranged in the vertical dimension rather than spreading out on the board surface.
3Area of stationary object
If monolithic integration of system components is used to reduce physical size, then footprint is reduced, but integration of components evolving at different rates becomes difficult
Solution Approach 1:
The patent divides the system into separate semiconductor dies that can be independently designed and fabricated using different process nodes and technologies. Each die can evolve at its own pace without requiring redesign of the entire system, while the standardized stacked architecture maintains compact integration. This segmentation enables heterogeneous integration of components with different technological requirements.
Solution Approach 2:
The stacked architecture with TSVs provides a universal interconnection platform that can accommodate various types of semiconductor dies (logic, memory, sensors, etc.) regardless of their specific technology or evolution stage. This multi-functional platform allows flexible integration of components with different technological requirements while maintaining a compact form factor.
Data Source
AI summary
Systems and methods of providing redundant functionality in a semiconductor die and package are provided. A three-dimensional electrical mesh network conductively couples smaller semiconductor dies, each including circuitry to provide a first functionality, to a larger base die that includes circuitry to provide a redundant first functionality to the semiconductor die circuitry. The semiconductor die circuitry and the base die circuitry selectively conductively couple to a common conductive structure such that either the semiconductor die circuitry or the base die circuitry is able to provide the first functionality at the conductive structure. Driver circuitry may autonomously or manually, reversibly or irreversibly, cause the semiconductor die circuitry and the base die circuitry couple to the conductive structure. The redundant first functionality circuitry improves the operational flexibility and reliability of the semiconductor die and package.