Semiconductor Device Heat Dissipation via Metal Block Recesses
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Solution Overview
Problem
Conventional transfer-mold type power semiconductor devices face challenges in heat dissipation, which can reduce the reliability of the semiconductor chip and prevent downsizing, as increasing the contacting area or temperature difference either compromises reliability or prevents efficient heat dissipation.
Innovation Solution
The design includes a metal block with recesses for mounting semiconductor chips and lead frames, along with insulating members and heat sinks, allowing for efficient heat dissipation through a combination of thermal conductivity and radiating fins without increasing the device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the temperature difference between the metal block and the heat sink is extended to improve heat dissipation, then the heat dissipation feature is improved, but the reliability of the semiconductor chip is reduced due to higher operating temperatures
Solution Approach 1:
The invention divides the heat dissipation path into multiple segments: the metal block with recesses creates extended contact surfaces, and the heat sink with radiating fins further segments the heat dissipation area. This segmentation allows heat to be dissipated through multiple pathways simultaneously, improving heat dissipation efficiency without requiring excessive temperature differences that would harm chip reliability.
Solution Approach 2:
The invention transitions from a simple planar contact interface to a three-dimensional structure with recesses in the metal block and radiating fins on the heat sink. This dimensional change significantly increases the effective contact area and heat dissipation surface area without increasing the footprint, enabling improved heat dissipation while maintaining reasonable operating temperatures.
2Loss of energy
If the contacting area between the power semiconductor device and the heat sink is increased to improve heat dissipation, then the heat dissipation feature is improved, but the device cannot be downsized
Solution Approach 1:
The invention employs a nested structure where the semiconductor chip is mounted within the recesses of the metal block, which itself is mounted on the heat sink. This nesting arrangement maximizes the use of vertical space and allows the heat dissipation components to be integrated within the device footprint, improving heat dissipation without increasing the overall device volume.
Solution Approach 2:
By utilizing the vertical dimension through recesses and radiating fins, the invention achieves a significant increase in effective heat dissipation area without proportionally increasing the device footprint. The radiating fins extend in the vertical direction, providing large heat dissipation surfaces while maintaining a compact horizontal profile.
3Loss of energy
If the contacting area is extended to improve heat dissipation, then the heat dissipation feature is improved, but the temperature inside the metal block decreases as being away from the power semiconductor chip, reducing the expected improvement
Solution Approach 1:
The invention applies local quality enhancement by concentrating thermal conductivity improvements at critical locations. The metal block with recesses ensures optimal thermal contact at the chip-bonding interface, while the heat sink with radiating fins provides enhanced heat dissipation at the output end. This localized optimization ensures efficient heat transfer throughout the thermal path without requiring uniform temperature distribution.
Solution Approach 2:
The thermal path is segmented into distinct functional zones: the metal block with recesses for optimal chip contact and heat collection, and the heat sink with radiating fins for efficient heat dissipation to the environment. This segmentation allows each component to be optimized for its specific thermal function, maintaining effective heat transfer despite temperature gradients.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation capabilities, improving the reliability of the power semiconductor device and enabling downsizing by effectively transmitting heat from the semiconductor chip to the heat sinks through high thermal conductivity materials and structures.
Implementation Method 1
heat generated in the power semiconductor chip is transmitted into the metal block and dissipated via the insulating layer or directly to the heat sink
Implementation Method 2
heat generated in the power semiconductor chip is transmitted into the metal block and dissipated via the insulating layer or directly to the heat sink
Implementation Method 3
heat generated in the power semiconductor chip is transmitted into the metal block and dissipated via the insulating layer or directly to the heat sink
Data Source
AI summary
The semiconductor device according to one of the embodiments of the present invention includes a metal block having first and second main surfaces and defining a recess on the first main surface. It also includes a semiconductor chip received within the recess of the metal block and mounted on the metal block. Further, a first terminal electrically connected with the semiconductor chip is provided, and a second terminal electrically connected with the metal block is also provided.