Resin Sealed Semiconductor Device With Metal Cap Heat Dissipation
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Solution Overview
Problem
Resin sealed semiconductor devices experience surface degradation and reliability issues when exposed to high-temperature environments due to cracking of the resin sealing body, which can compromise the integrity of the semiconductor device.
Innovation Solution
A semiconductor device manufacturing method where a lid with a recessed portion and flange is used to form a space for the resin sealing body, with the resin supplied from a corner of the lid, and a cap is bonded over the sealing body to dissipate heat and prevent cracking, utilizing a metal cap with a higher radiation factor than the resin to suppress temperature increases and enhance adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin is used as the sealing body material, then ease of manufacture and sealing properties are improved, but reliability deteriorates under high-temperature conditions due to surface degradation and cracking
Solution Approach 1:
The patent applies composite materials by combining resin with a rubber-like substance to create a sealing body that exhibits both elasticity and sealing properties. This composite structure prevents cracking under thermal stress while maintaining ease of manufacture, resolving the contradiction between manufacturability and high-temperature reliability
Solution Approach 2:
The patent changes the material parameters of the sealing body by incorporating a rubber-like substance that provides elasticity. This parameter change allows the sealing body to withstand thermal expansion and contraction without cracking, improving reliability under high-temperature conditions while retaining the ease of resin-based manufacturing
2Ease of manufacture
If resin sealing body is used, then ease of manufacture is improved, but resistance to thermal stress deteriorates leading to cracking
Solution Approach 1:
The patent creates a composite sealing body by combining resin with a rubber-like substance. The rubber-like component provides elasticity and flexibility that enables the sealing body to resist thermal stress and prevent cracking, while the resin component maintains ease of manufacture
Solution Approach 2:
The patent incorporates a rubber-like substance that provides flexible, elastic properties to the sealing body. This flexibility allows the sealing body to deform elastically under thermal stress without cracking, resolving the contradiction between ease of manufacture and thermal stress resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the reliability of semiconductor devices by preventing resin cracking and maintaining the integrity of the sealing body under high-temperature conditions, ensuring the semiconductor device's performance and longevity.
Implementation Method 1
a cap is bonded over the sealing body to dissipate heat and prevent cracking, utilizing a metal cap with a higher radiation factor than the resin to suppress temperature increases
Data Source
AI summary
Provided is a resin sealed semiconductor device with improved reliability. After positioning a cap (lid) so as to cover semiconductor chips and wires, resin is supplied into a space formed by the cap, so that a sealing body is formed to cover the semiconductor chips and the wires. In the step of forming the sealing body, the resin is supplied from an opening formed at a corner of the cap in the planar view. The sealing body is exposed at the corner of the cap, so that the exposed part of the sealing body can be kept away from the wires.