Semiconductor Chip Package Metal Plate Cooling Surface
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Solution Overview
Problem
Current semiconductor device packaging methods are costly and struggle to provide high thermal robustness while maintaining low manufacturing expenses, which is essential for efficient heat dissipation and performance enhancement.
Innovation Solution
A semiconductor chip package design featuring an electrically conducting carrier, a semiconductor chip, and a metal plate where the metal plate overlaps and partially exposes at the periphery, allowing for effective heat dissipation through top-side cooling and dynamic thermal management by being mechanically and thermally connected to a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging methods are used, then manufacturing cost is reduced, but thermal robustness and heat dissipation capability deteriorate
Solution Approach 1:
The packaging structure is segmented into distinct functional layers: the electrically conducting carrier for electrical connections, the semiconductor chip for device functionality, and the metal plate for thermal management. This segmentation allows each component to be optimized independently for its specific function while maintaining overall cost-effectiveness.
Solution Approach 2:
The metal plate serves multiple functions simultaneously: it acts as a thermal management component for heat dissipation, provides mechanical support for the semiconductor chip, and enables top-side cooling capabilities. This multi-functionality improves thermal robustness without adding separate dedicated components that would increase manufacturing complexity.
2Temperature
If the metal plate is made larger to improve cooling, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The metal plate is merged with the existing package structure, integrating thermal management functionality into the housing or package substrate. This integration approach allows the metal plate to extend across multiple components without requiring separate mounting hardware or complex assembly procedures, thereby improving heat dissipation while maintaining structural simplicity.
3Reliability
If top-side cooling is implemented, then thermal robustness is improved, but manufacturing complexity increases
Solution Approach 1:
The cooling solution extends into the vertical dimension by utilizing the top surface of the semiconductor chip and the metal plate above it, rather than relying solely on bottom-side cooling through the carrier. This dimensional expansion enables effective heat dissipation pathways without complicating the lateral package footprint or requiring additional complex cooling structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal power dissipation capabilities, reducing the demand on the electrically conducting carrier for heat removal and preventing overheating, thus improving the performance and reliability of semiconductor devices with high thermal power loss.
Implementation Method 1
The exposed second surface of the metal plate is mechanically connected to a heat sink... The metal plate has a first surface mechanically connected to the second surface of the semiconductor chip
Data Source
AI summary
A semiconductor chip package includes an electrically conducting carrier and a semiconductor chip disposed over the electrically conducting carrier. The semiconductor chip has a first surface facing the electrically conducting carrier and a second surface opposite the first surface. A metal plate has a first surface mechanically connected to the second surface of the semiconductor chip and a second surface opposite the first surface of the metal plate. The metal plate completely overlaps the second surface of the semiconductor chip. The second surface of the metal plate is at least partially exposed at a periphery of the semiconductor chip package.