Semiconductor Device Metal Plate Shielding Heat
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Solution Overview
Problem
Conventional semiconductor packaging techniques face challenges with electromagnetic noise, heat generation, and performance degradation due to increased terminal count and narrow pitch connections, which affect the reliability and efficiency of semiconductor devices.
Innovation Solution
A semiconductor device with a metal plate supporting the semiconductor element and a wiring board featuring alternately stacked insulating and wiring layers, where the electrode terminals and wiring layers are electrically connected via vias and the metal plate, enhancing electromagnetic shielding and heat radiation while accommodating increased terminal counts and narrow pitch connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire bonding is used to connect wiring board and semiconductor element, then cost is reduced, but wire diameter must be decreased to narrow pitch, causing wire disconnection and strict connection conditions
Solution Approach 1:
The patent extracts the problematic wire bonding process and replaces it with direct electrode-terminal-to-wiring-layer connections through the insulating layer. This eliminates the intermediate wire element that causes disconnection issues when pitch is narrowed, while maintaining cost-effectiveness by using existing electrode terminals instead of adding separate connection elements.
Solution Approach 2:
The patent introduces an intermediary connection structure where wiring layers extend directly to electrode terminals through the insulating layer. This intermediary wiring layer configuration allows for narrow pitch connections without the fragility of thin wires, as the wiring layers provide robust electrical pathways while the insulating layer maintains electrical isolation.
2Speed
If flip-chip bonding is used to connect wiring board and semiconductor element, then higher-speed transmission is enabled, but connection strength of solder bumps is decreased when terminal count is increased or narrow pitch is used, causing cracks and defective connections
Solution Approach 1:
The patent extracts the solder bump connection method and replaces it with direct wiring layer-to-electrode terminal connections. This eliminates the solder bumps that are prone to cracking and void formation under high terminal count and narrow pitch conditions, while maintaining the high-speed transmission capability through direct electrical pathways.
Solution Approach 2:
The patent replaces the expensive and unreliable solder bump connections with a more robust wiring layer extension approach. The wiring layers serve as permanent, integrated connection structures that are part of the substrate itself, providing long-term reliability without the need for separate bonding materials that can fail over time.
3Temperature
If metal heat sink is used to improve heat radiation, then heat radiation characteristics are improved, but electromagnetic noise is received as the heat sink functions as an antenna, causing performance degradation
Solution Approach 1:
The patent converts the potential harm of the metal plate acting as an electromagnetic antenna into a benefit by using it as an electromagnetic shield. The metal plate is electrically connected to ground through the wiring layers, transforming it from a noise-receiving element into an active shielding structure that protects sensitive circuit areas from external electromagnetic interference while maintaining heat radiation functionality.
Solution Approach 2:
The metal plate serves multiple functions simultaneously: it acts as a heat sink for thermal management, an electromagnetic shield for noise protection, and a structural support element. By integrating these multiple functions into a single component, the patent eliminates the need for separate heat sink and shielding structures, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves characteristic impedance, reduces unwanted electromagnetic radiation, and enhances heat radiation characteristics, preventing performance degradation and enabling thinner, cost-effective semiconductor packages with increased terminal counts and narrow pitch connections.
Implementation Method 1
the metal plate 11 is electrically connected to the wiring board 30... excellent heat radiation characteristics
Implementation Method 2
the metal plate 11 is electrically connected to the wiring board 30... reduction in unwanted electromagnetic radiation
Implementation Method 3
the electrode terminals and the external connection terminals are electrically connected via at least one of the wiring layers and the vias
Data Source
AI summary
A semiconductor device includes: at least one semiconductor element having electrode terminals; a metal plate supporting the semiconductor element; and a wiring board covering the semiconductor element and including a plurality of insulating layers and wiring layers alternately stacked and external connection terminals on a surface, the wiring layers being electrically connected to each other by vias. The electrode terminals and the external connection terminals are electrically connected via at least one of the wiring layers and the vias. At least one of the electrode terminals, the is wiring layers, and the vias is electrically connected to the metal plate.