Semiconductor Device Metal Plate Shielding and Fixing
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving high vibration resistance and electromagnetic noise immunity due to limitations in fixing points for control boards and the inability of previous solutions to effectively shield electromagnetic noise from semiconductor modules.
Innovation Solution
A semiconductor device configuration where semiconductor modules are supported by a cooling plate and covered by a metal plate that also fixes the control board opposite the semiconductor modules, utilizing a metal plate made of materials like aluminum, copper, or iron, which is supported by a ground-potential support member to act as an electromagnetic shield and enhance vibration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the control board is fixed using another member due to limitations in providing fixing points on semiconductor modules, then the vibration resistance can be improved, but the device complexity and size increase
Solution Approach 1:
The patent combines the fixing member with the semiconductor module housing into a single integrated structure. The housing itself is designed with recesses and protrusions that directly engage with the control board, eliminating the need for separate fixing members. This merging of functions reduces device complexity while maintaining vibration resistance.
Solution Approach 2:
The housing of the semiconductor module serves multiple functions: it encloses the semiconductor components, provides structural support, and simultaneously acts as the fixing mechanism for the control board through its integrated recesses and protrusions. This multi-functionality eliminates the need for additional dedicated fixing members.
2Volume of moving object
If the control board is disposed to overlap the semiconductor modules, then the space efficiency is improved, but the electromagnetic noise from semiconductor modules affects the control board
Solution Approach 1:
The patent introduces a ground potential layer as an intermediary between the semiconductor modules and the control board. This ground layer acts as a shield that intercepts electromagnetic noise from the semiconductor modules before it can reach the control board, while still allowing the control board to be positioned close to the semiconductor modules for space efficiency.
Solution Approach 2:
The housing is designed with differentiated local properties: certain regions provide electromagnetic shielding with ground potential layers, while other regions allow for direct engagement and fixing of the control board. This local differentiation of functional qualities enables both noise protection and compact positioning.
3Volume of moving object
If wiring electrodes are disposed close to the control board for compact design, then the device size is reduced, but the electromagnetic noise from wiring electrodes increases the malfunction risk of the control board
Solution Approach 1:
A ground potential layer is positioned between the wiring electrodes and the control board to serve as an electromagnetic shield. This intermediary ground layer intercepts noise from the wiring electrodes, allowing the wiring electrodes to be disposed close to the control board for compact design while protecting against electromagnetic interference.
4Reliability
If a large metal plate is used to fix the control board to the exterior case, then the vibration resistance and electromagnetic shielding are improved, but the device size and cost increase
Solution Approach 1:
The patent merges the fixing function into the semiconductor module housing itself, which is already present in the device. The housing's integrated recesses and protrusions provide the fixing mechanism, eliminating the need for a separate large metal plate. This reduces device size while maintaining vibration resistance through the direct engagement structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides a compact, cost-effective semiconductor device with improved vibration resistance and electromagnetic noise immunity by using the metal plate as a shield and increasing the number of fixing points for the control board, while minimizing the device's size and cost.
Implementation Method 1
a metal plate which supports a control board for controlling the semiconductor modules, wherein the metal plate, being supported by the support member, covers the semiconductor modules
Data Source
AI summary
A semiconductor device includes semiconductor modules disposed on a support member via a cooling plate; and a metal plate which supports a control board for controlling the semiconductor modules, wherein the metal plate, being supported by the support member, covers the semiconductor modules, and also fixes the control board opposite the installation surfaces of the semiconductor modules.