Semiconductor Device Metal Plate Tilt Prevention
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Solution Overview
Problem
The existing semiconductor devices face a risk of metal plate tilt due to uneven shrinkage of soldered portions, which can lead to electrical connectivity issues and device instability.
Innovation Solution
The semiconductor device design incorporates soldered portions with varying solidifying points and thicknesses, ensuring that the soldered portions between the metal plates solidify before the joint soldered portion, preventing plate tilt by maintaining the edges of the metal plates free from constraint during shrinkage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the soldered portion between the joints solidifies before the soldered portions between the metal plates, then the manufacturing process is simplified, but the metal plates may tilt due to shrinkage constraints
Solution Approach 1:
The patent changes the solidification parameter by controlling the thickness of different soldered portions. The soldered portions between metal plates are made thinner (0.05-0.15mm) than the soldered portion between joints (0.2-0.5mm), causing them to solidify first and prevent plate tilt through their shrinkage action.
Solution Approach 2:
The patent prepares the soldered portions between metal plates with specific thickness in advance, so that when solidification occurs, these portions shrink first to cushion and prevent the metal plates from tilting before the joint soldered portion solidifies and constrains the edges.
2Stability of the object's composition
If the soldered portions between metal plates are made thinner to solidify first, then plate tilt is prevented, but the electrical connectivity and mechanical strength may be reduced
Solution Approach 1:
The patent optimizes the thickness parameter of soldered portions between metal plates to a specific range (0.05-0.15mm) that is thin enough to solidify first and prevent tilt, yet thick enough to maintain adequate electrical connectivity and mechanical strength for the application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents metal plate tilt, ensuring stable electrical connections and maintaining the parallelism of heat diffusing plates, thereby enhancing the reliability and performance of the semiconductor device.
Implementation Method 1
The soldered portions shrink upon solidifying
Data Source
AI summary
A semiconductor device may include: a first and a second semiconductor elements each including electrodes on both surfaces thereof; a first and a second metal plates which interpose the first semiconductor element, the metal plates respectively being bonded to the first semiconductor element via first soldered portions; and a third and a fourth metal plates which interpose the second semiconductor element, the metal plates respectively being bonded to the second semiconductor element via second soldered portions; wherein a first joint is provided at the first metal plate, a second joint is provided at the fourth metal plate, the joints are bonded via a third soldered portion, and a solidifying point of the first soldered portions is higher than a solidifying point of the third soldered portion, and a solidifying point of the second soldered portions is higher than the solidifying point of the third soldered portion.