Semiconductor Metal Plating Structure for Low High-Frequency Loss

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Solution Overview

Problem

Conventional nickel plating layers in semiconductor devices increase conductor loss at high frequencies due to nickel's magnetic properties, hindering efficient operation.

Innovation Solution

A metal component for semiconductor devices is designed with a substrate having a conductivity, a nickel layer as the main component on its surface, and a noble metal layer on top, which reduces the volume of nickel and includes a phosphorus-doped nickel layer to inhibit copper diffusion, thereby minimizing conductor loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a nickel plating layer is formed on the metal substrate, then corrosion resistance and bonding characteristics are improved, but conductor loss increases at high frequencies due to nickel's magnetic properties

Engineering Contradiction:

Improvecorrosion resistanceVSAvoidconductor loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The plating structure is divided into multiple layers: a nickel layer for corrosion protection and bonding, and an additional nickel-free layer on top to eliminate magnetic losses. This segmentation allows each layer to perform its specific function without the drawbacks of using nickel throughout the entire plating structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The nickel layer is applied only where needed for corrosion resistance and bonding characteristics, while the nickel-free layer is applied in regions where high-frequency signal transmission occurs. This local differentiation optimizes both corrosion protection and electrical performance.

Inventive Principle:

Principle #3Local quality

2Strength

If a nickel plating layer is formed on the metal substrate, then bonding characteristics are improved, but conductor loss increases at high frequencies

Engineering Contradiction:

Improvebonding characteristicsVSAvoidconductor loss

Core Design Contradiction:

StrengthVSLoss of energy

Solution Approach 1:

The plating structure is divided into multiple layers: a nickel layer for corrosion protection and bonding characteristics, and an additional nickel-free layer on top to eliminate magnetic losses. This segmentation allows each layer to perform its specific function without the drawbacks of using nickel throughout the entire plating structure.

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If conventional nickel plating is used, then manufacturing simplicity is maintained, but high-frequency operation efficiency deteriorates

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidhigh-frequency operation efficiency

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables semiconductor devices to operate efficiently at high frequencies by reducing nickel volume and conductor loss, improving bonding characteristics and wettability, and enhancing reliability.

Implementation Method 1

a phosphorus-doped nickel layer to inhibit copper diffusion

Methodology Applied

Scientific EffectDiffusion barrier: Diffusion Barrier

Data Source

PatentUS20240079298A1Metal component

Publication Date: 2024.03.07 MITSUI HIGH TEC INC

AI summary

Provided is a metal component used for manufacturing a semiconductor device, the metal component including: a substrate having a conductivity; a nickel layer formed on a portion of a surface of the substrate and containing nickel as a main component; and a noble metal layer formed on a surface of the nickel layer.