Semiconductor Surface-Treatment Composition for Selective Metal Coating
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Solution Overview
Problem
Existing compositions for selectively modifying semiconductor substrates fail to form a coating film preferentially on surfaces containing metal atoms after storage, leading to unintended film formation on non-metal surfaces.
Innovation Solution
A composition comprising a polymer with specific functional groups that interact with metal surfaces, an ethylenically unsaturated group, and a polymerization inhibitor, along with a solvent, is used to form a coating film preferentially on metal-containing surfaces even after storage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a composition containing a polymer with a polymerizable functional group (ethylenically unsaturated group) is used for selective surface modification, then the coating film can be formed on the substrate surface, but after storage the composition loses its selectivity and forms coating films on non-metal surfaces as well
Solution Approach 1:
The patent introduces a polymerization inhibitor into the composition before storage to prevent premature polymerization. This preliminary protective action maintains the composition's stability during storage while preserving its selective coating-forming capability on metal surfaces. The inhibitor is consumed or deactivated upon contact with metal surfaces, allowing the polymerization to proceed selectively at that location.
Solution Approach 2:
The polymerization inhibitor acts as an intermediary substance that mediates between the polymerizable functional groups and the storage environment. It temporarily suppresses the polymerization reaction during storage, then allows it to proceed when the composition contacts metal surfaces, thereby maintaining both storage stability and selective coating formation capability.
2Ease of manufacture
If the composition is stored for a certain period, then it can be kept ready for use, but the polymerizable groups undergo unintended polymerization and the composition can no longer selectively modify metal surfaces
Solution Approach 1:
The patent converts the potentially harmful effect of premature polymerization during storage into a beneficial selective reaction at the target metal surface. By using a polymerization inhibitor that is specifically deactivated by metal surfaces, the composition maintains stability during storage and then selectively polymerizes only when contacting metal surfaces, turning a stability problem into a selective modification advantage.
Solution Approach 2:
The patent changes the chemical environment parameters by introducing a polymerization inhibitor that alters the reactivity of the polymerizable functional groups. This parameter change suppresses polymerization during storage but allows it to proceed selectively upon contact with metal surfaces, thereby maintaining composition stability while preserving functional activity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively forms a coating film on metal-containing surfaces while inhibiting polymerization, ensuring selective modification even after storage, thereby maintaining performance over time.
Implementation Method 1
a polymer which has, at a terminal of a main chain or a side chain, a group including a first functional group forming a coordinate bond with the metal
Implementation Method 2
a polymerization inhibitor
Data Source
AI summary
The present invention provides a composition for treating a semiconductor device, which can preferentially form a coating film on a first surface in a case of being brought into contact with a substrate having a first surface containing a metal atom and a second surface not containing a metal atom, and can selectively form a coating film on the first surface even after storage; and a method for manufacturing a modified substrate using the composition for treating a semiconductor device. The composition for treating a semiconductor device of the present invention contains a polymer having a functional group which interacts with a surface containing a metal atom in a substrate and an ethylenically unsaturated group, a polymerization inhibitor, and a solvent.