Semiconductor Device Metallic Core Layer Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices face challenges with increased size, reliability issues, and high costs due to wire bonding, and high-density packages struggle with heat release performance and layout constraints, especially in severe environments, leading to insufficient heat dissipation and increased production costs.
Innovation Solution
A semiconductor device with a metallic core layer and conductive bumps on a substrate, sealed with a thermally hardenable resin, providing enhanced heat releasability and reliability without the need for high-density packaging, using a printed circuit board or flexible substrate with conductive bumps for electrical connection and a metallic core layer for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding techniques are used to connect electrode portions of semiconductor elements to leads of lead frame, then electrical connection is achieved, but device size increases and reliability decreases
Solution Approach 1:
The patent extracts and eliminates the lead frame structure entirely, replacing it with a substrate that integrates the semiconductor element mounting area and external connection terminals in a compact configuration. This removes the need for wire bonding and lead frame connections, thereby reducing device size while improving reliability through direct bonding techniques.
Solution Approach 2:
The patent merges the substrate, semiconductor element mounting area, and external connection terminals into a single integrated structure. The substrate serves multiple functions: supporting semiconductor elements, providing electrical connections through conductive patterns, and offering external terminals. This consolidation eliminates separate lead frames and wire bonds, reducing overall device size and improving connection reliability.
2Area of stationary object
If high-density packaging is used to increase packaging density, then miniaturization is achieved, but heat release performance deteriorates
Solution Approach 1:
The patent applies local quality by creating a thermally conductive core layer specifically in the region where heat dissipation is most critical - beneath and around the semiconductor element mounting area. This core layer has superior thermal conductivity compared to the surrounding substrate material, providing targeted heat extraction pathways that do not compromise the compact package design. The thermal management solution is localized to where it is most needed, allowing high-density packaging while maintaining effective heat release.
3Length of stationary object
If narrow-pitch packages are used to achieve miniaturization, then device size decreases, but reliability of conductive bumps decreases
Solution Approach 1:
The patent employs composite materials in the form of a substrate combining different material layers with complementary properties. The thermally conductive core layer is integrated within the substrate structure, providing enhanced thermal management that indirectly supports conductive bump reliability by preventing excessive heat accumulation at the bump locations. This composite structure allows narrow-pitch packaging while maintaining bump reliability through improved thermal dissipation.
4Adaptability or versatility
If multiple high heat-release components are mounted to achieve high functionality, then device functionality increases, but heat dissipation capability becomes insufficient
Solution Approach 1:
The patent segments the thermal management function by introducing a dedicated thermally conductive core layer that is distinct from the surrounding substrate material. This core layer creates independent thermal pathways that can handle heat from multiple high-power components simultaneously. The segmented thermal management architecture allows the substrate to support multiple heat-generating components while maintaining adequate heat dissipation capability through the distributed thermal conduction paths provided by the core layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves superior heat releasability and reliability at lower costs, eliminating the need for narrow-pitch packages and reducing the risk of conductive bump failure, while maintaining high functionality and miniaturization, even in severe environments.
Implementation Method 1
sealed with a thermally hardenable resin
Implementation Method 2
metallic core layer for improved thermal management
Implementation Method 3
conductive bumps for electrical connection
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A semiconductor device with enhanced heat releasability and low-cost manufacturability is disclosed. This device has a substrate (1) with an electronic circuit disposed on a first principal surface, a semiconductor element (6) which is provided at the first surface of the substrate and electrically connected by wire bonding (2) to the electronic circuit, a metallic core layer (1a) which is provided in the substrate (1) and electrically connected to the semiconductor element (6), a plurality of conductive bumps (7) provided on a second principal surface opposite to the first surface of the substrate (1), a thermal hardenable sealing resin (5) for sealing at least the semiconductor element (6) and the first surface side of the substrate (1), and a metal plate (8) provided at the second surface for being electrically connected to the metal core layer (la). An electronic control module using the device is also disclosed.