Semiconductor Structure With Metallic Shielding for Optical Coupling
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Solution Overview
Problem
There is a challenge in minimizing interference between photoelectric devices and dies in semiconductor structures, leading to optical loss and reduced optical coupling efficiency.
Innovation Solution
A semiconductor structure is designed with a metallic shield extending through the redistribution layer to surround light-conducting members, along with reflective layers to enhance light collection and transmission, thereby reducing optical loss and improving coupling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If photoelectric devices and dies are integrated in close proximity to improve integration density, then the integration density increases, but optical interference and optical loss increase
Solution Approach 1:
A metallic shield structure is introduced as an intermediary element between the photoelectric device and the die to block optical interference. The shield extends through the redistribution layer and surrounds the light-conducting member, acting as a physical barrier that prevents stray light from reaching sensitive areas while allowing the close integration of photoelectric devices and dies to maintain high integration density
2Productivity
If photoelectric devices and dies are integrated in close proximity to improve integration density, then the integration density increases, but optical coupling efficiency decreases
Solution Approach 1:
The metallic shield structure is selectively positioned in specific locations where optical interference occurs, rather than uniformly across the entire structure. The shield surrounds the light-conducting member and extends through the redistribution layer at critical areas, providing localized protection against optical interference while maintaining optical coupling efficiency in the photoelectric device-die interface
Solution Approach 2:
The metallic shield serves as a mediating structure that separates optical paths and prevents cross-interference between adjacent photoelectric devices and dies. By strategically placing the shield around light-conducting members and extending through the redistribution layer, it creates isolated optical channels that maintain coupling efficiency despite close integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metallic shield and reflective layers minimize interference, reducing optical loss and enhancing the optical coupling efficiency between photoelectric devices and dies.
Implementation Method 1
a metallic shield extending at least partially through the redistribution layer and surrounding the first opening
Implementation Method 2
The metallic shield and reflective layers minimize interference, reducing optical loss
Implementation Method 3
reflective layers to enhance light collection and transmission
Data Source
AI summary
The semiconductor structure includes a die, a dielectric layer surrounding the die, a photoelectric device disposed adjacent to the die and surrounded by the dielectric layer, a first opening extending through the redistribution layer and configured to receive a light-conducting member, and a metallic shield extending at least partially through the redistribution layer and surrounding the first opening. A method for forming a semiconductor structure includes receiving a die; forming a dielectric layer to surround the die; and disposing a photoelectric device surrounded by the dielectric layer; forming a redistribution layer over the die, the dielectric layer and the photoelectric device; and removing a portion of the redistribution layer to form a first opening over the photoelectric device. A metallic shield extending at least partially through the redistribution layer and surrounding the first opening is formed during the formation of the redistribution layer.