Semiconductor Structure Metallic Shielding Layer
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Solution Overview
Problem
The miniaturization of semiconductor devices leads to increased complexity in manufacturing and integration, resulting in issues such as poor electrical interconnection, delamination, and electromagnetic interference, which affect the performance and reliability of semiconductor structures.
Innovation Solution
A semiconductor structure is designed with a metallic layer surrounding the die and substrate, electrically connected to a conductive trace and grounded, providing electromagnetic shielding to prevent interference and improve operational stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor devices are miniaturized and integrated in high-density configurations, then device functionality and integration amount increase, but manufacturing complexity increases and causes poor electrical interconnection, delamination, and electromagnetic interference
Solution Approach 1:
The patent segments the semiconductor structure into distinct functional layers including a substrate, molding compound, and a separate metallic shielding layer. This segmentation allows each layer to be optimized independently - the substrate for electrical interconnection, the molding for protection, and the metallic layer for electromagnetic shielding - thereby managing manufacturing complexity while maintaining high functionality
Solution Approach 2:
The metallic shielding layer acts as an intermediary element between the internal semiconductor components and the external electromagnetic environment. This intermediate layer absorbs or reflects electromagnetic interference before it reaches sensitive components, resolving the contradiction by adding a dedicated functional layer that protects against interference without complicating the core device architecture
2Adaptability or versatility
If manufacturing operations are increased for integration of various semiconductor devices, then device functionality improves, but deficiencies such as poor electrical interconnection, delamination, and interference occur
Solution Approach 1:
The metallic shielding layer is incorporated into the molding structure beforehand to prevent electromagnetic interference before it can affect electrical interconnection quality. This preventive measure addresses potential reliability issues arising from increased manufacturing operations by establishing protective barriers during the manufacturing process itself rather than as a post-processing fix
3Object-affected harmful factors
If metallic layer is added to provide electromagnetic shielding, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The metallic layer serves multiple functions simultaneously: it provides electromagnetic shielding, acts as a ground reference for signal traces, and forms part of the overall package structure. This multi-functionality reduces the need for separate dedicated components, thereby limiting the increase in device complexity while achieving effective electromagnetic interference reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metallic layer effectively isolates the semiconductor structure from external electromagnetic radiation, reducing interference and enhancing the performance and reliability of the semiconductor devices by grounding the conductive trace and die.
Implementation Method 1
a metallic layer surrounding the molding and the substrate, wherein the metallic layer is electrically connected to at least a portion of the conductive trace exposed through the substrate
Data Source
AI summary
The present disclosure relates to a semiconductor structure and a method of manufacturing the semiconductor structure. The semiconductor structure includes a substrate including a first surface and a conductive trace extending over the substrate; a die disposed over the first surface of the substrate; a molding disposed over the first surface of the substrate and covering the die; and a metallic layer surrounding the molding and the substrate, wherein the metallic layer is electrically connected to at least a portion of the conductive trace exposed through the substrate.