Automated Semiconductor Metrology Root Cause Analysis
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Solution Overview
Problem
Existing semiconductor metrology systems face challenges in efficiently identifying and analyzing abnormal measurements, as manually determining their root cause is time-consuming and often results in deficient component fabrication.
Innovation Solution
A system and method that utilize hardware processors to automatically determine the parameters causing abnormal semiconductor metrology measurements by ranking potential sources, selecting the top-ranked parameters, and analyzing them to identify the root cause of the abnormality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If abnormal measurements are manually analyzed to determine root cause, then measurement precision is maintained, but productivity deteriorates due to time-consuming analysis
Solution Approach 1:
The patent replaces the manual mechanical analysis process with an automated computational system. The system uses software algorithms to automatically analyze abnormal measurements, compare them against expected values, identify root causes, and generate reports, thereby maintaining measurement precision while dramatically improving productivity by eliminating time-consuming manual analysis.
2Reliability
If all parameters are tested to identify abnormal measurement causes, then reliability is improved, but loss of time increases due to extensive testing
Solution Approach 1:
The patent extracts and focuses only on the critical parameters that are most likely to cause abnormal measurements. The system automatically identifies and isolates the specific parameters deviating from expected values, rather than requiring comprehensive testing of all parameters. This extraction approach maintains reliability by targeting the root cause while significantly reducing the time required for analysis.
3Productivity
If abnormal measurements are disregarded, then productivity is maintained, but manufacturing precision deteriorates due to fabrication of deficient components
Solution Approach 1:
The patent implements an automated feedback system that continuously monitors measurements, immediately identifies abnormalities, and alerts operators to potential manufacturing issues. This feedback mechanism ensures that abnormal measurements are not disregarded but are instead quickly detected and addressed, maintaining manufacturing precision while preserving productivity through automated rather than manual processes.
Data Source
AI summary
A system, method, and computer program product are provided for automatically determining a parameter causing an abnormal semiconductor metrology measurement. In use, an abnormal semiconductor metrology measurement measured from a fabricated semiconductor component is received. At least one parameter of the fabricated semiconductor component causing the abnormal semiconductor metrology measurement is then automatically determined by one or more hardware processors. In particular, the one or more hardware processors determine a subset of parameters of the fabricated semiconductor component as potential sources of the abnormal semiconductor metrology measurement, rank the parameters in the determined subset of parameters, select an Nth number of the parameters in the determined subset of parameters in accordance with the ranking, and then analyze each of the selected parameters to identify one or more of the selected parameters as the at least one parameter of the fabricated semiconductor component causing the abnormal semiconductor metrology measurement.