Semiconductor Microlens Fabrication for Dense Uniform Optical Arrays
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Solution Overview
Problem
Conventional optical devices face long manufacturing cycles and poor microlens density, uniformity, and low optical efficiency due to separate chip and microlens fabrication processes.
Innovation Solution
A method of fabricating optical devices by forming a dielectric layer on a substrate, patterning it to create openings, and rounding these openings into microlenses within a chip fabrication plant, using semiconductor processes to enhance density and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If microlenses are fabricated in a separate microlens fabrication plant after chip fabrication, then specialized equipment can be used, but the manufacturing cycle becomes long due to transportation and handling time
Solution Approach 1:
The patent merges the microlens fabrication process with the chip fabrication process by integrating all necessary steps (forming dielectric layers, patterning, and rounding) into a single manufacturing line. This eliminates the need for separate transportation and handling between facilities, thereby reducing manufacturing cycle time while maintaining microlens quality through controlled semiconductor processes.
Solution Approach 2:
The patent performs preliminary actions by forming the dielectric layer and creating the microlens structure during the chip fabrication process itself, before the chip is completed and shipped. This preliminary formation of microlenses ensures they are ready for use without requiring post-fabrication processing at a separate facility.
2Ease of manufacture
If conventional microlens fabrication processes are used, then existing equipment can be utilized, but the microlens density and uniformity are poor resulting in low optical efficiency
Solution Approach 1:
The patent changes the fabrication parameters by using semiconductor manufacturing techniques with precisely controlled deposition and etching parameters. The dielectric layer is formed with controlled thickness and composition, and the rounding process uses controlled removal to achieve uniform curvature. These parameter changes enable high-density, uniform microlenses with superior optical efficiency while maintaining ease of manufacture through standardized semiconductor processes.
3Adaptability or versatility
If multiple separate processes are used for chip and microlens fabrication, then each process can be optimized independently, but the overall device complexity and manufacturing steps increase
Solution Approach 1:
The patent combines multiple fabrication processes into a single integrated flow where dielectric layers are formed, patterned, and rounded in sequence within the chip fabrication facility. This merging reduces the number of separate manufacturing steps and eliminates intermediate handling, thereby reducing overall device complexity while maintaining the ability to optimize each step using established semiconductor process control methods.
Data Source
AI summary
The present invention provides an optical device and a method of fabricating the same. A first dielectric layer is formed on a substrate structure and then patterned and partially removed, forming openings therein, which define at least one first dielectric sub-layer in the first dielectric layer. The first dielectric sub-layer is rounded into a microlens. In this way, the microlens can be fabricated in a chip fabrication plant, without needing to deliver an associated chip to a dedicated microlens fabrication plant, thereby improving production efficiency and shortening the manufacturing cycle. The microlens can be fabricated in the optical device using a semiconductor process and thus exhibits increased density and uniformity, resulting in higher optical efficiency.