Semiconductor Mirror Layer Adhesion via Discrete Domains
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Solution Overview
Problem
Radiation-emitting semiconductor components face issues with the detachment of mirror layers due to low adhesion of materials with high reflectivity, such as silver, to the semiconductor material.
Innovation Solution
A semiconductor component design featuring a mirror region with domains of a first material composition for adhesion promotion and a continuous mirror layer of a second material for high reflectivity, where the domains and mirror layer are strategically distributed to ensure reliable adhesion and high reflectivity, using materials like rhodium and silver, and a method involving deposition and heat treatment to achieve optimal surface occupation density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a mirror layer material with high reflectivity (e.g., silver) is applied uniformly over the semiconductor body surface, then the reflectivity of the component is improved, but the adhesion of the mirror layer to the semiconductor body deteriorates
Solution Approach 1:
The patent applies local quality by creating domains of adhesion promoter material distributed at specific locations on the semiconductor body surface, rather than applying a uniform layer. These discrete domains provide localized adhesion enhancement while allowing the mirror layer material to maintain its high reflectivity properties in the regions where it directly contacts the semiconductor body.
Solution Approach 2:
The patent employs composite materials by combining adhesion promoter material with mirror layer material in a structured arrangement. The adhesion promoter domains are embedded in or adjacent to the mirror layer, creating a composite structure that simultaneously provides both adhesion function and optical reflection function, resolving the contradiction between these two properties.
2Reliability
If an adhesion promoter layer is applied uniformly over the semiconductor body surface, then the adhesion of the mirror layer is improved, but the reflectivity of the component deteriorates
Solution Approach 1:
The patent resolves this contradiction by applying the adhesion promoter material only in discrete domains at specific locations rather than as a uniform continuous layer. This localized application ensures that adhesion is enhanced only where the domains are present, while the remaining surface areas maintain high reflectivity by having direct contact between the mirror layer and semiconductor body.
Solution Approach 2:
The patent segments the adhesion promoter material into discrete domains distributed across the semiconductor body surface. This segmentation allows the adhesion function to be provided only in specific regions, while other regions remain dedicated to optical reflection, thus avoiding the reflectivity loss that would occur with a uniform adhesion promoter layer.
3Reliability
If platinum is used as the mirror layer material to ensure good adhesion, then the adhesion is improved, but the reflectivity and electrical conductivity deteriorate
Solution Approach 1:
The patent uses adhesion promoter material domains as intermediary elements between the semiconductor body and the mirror layer material. These intermediary domains provide the necessary adhesion function, allowing the use of mirror layer materials with high reflectivity that would otherwise have poor adhesion. This eliminates the need to use platinum, which has poor reflectivity, while still achieving good adhesion through the intermediary adhesion promoter domains.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable adhesion and high reflectivity of the mirror layer, maintaining performance even with materials that would otherwise exhibit low adhesion when applied uniformly, thereby enhancing the stability and efficiency of radiation-emitting semiconductor components.
Implementation Method 1
domains of a first material composition... serve as adhesion promoters
Implementation Method 2
mirror layer... high reflectivity... for the radiation that is to be detected or is emitted by the active region
Implementation Method 3
method involving deposition and heat treatment to achieve optimal surface occupation density
Data Source
AI summary
A method for manufacturing an optoelectronic semiconductor component and an optoelectronic semiconductor component are disclosed. In an embodiment the component comprises a semiconductor body having a main surface and a mirror region adjoining the main surface of the semiconductor body at least regionally, wherein the minor region has a plurality of domains of a first material composition, the domains being spaced apart from one another and adjoining the main surface, wherein the mirror region comprises a continuous mirror layer of a second material composition, and wherein the mirror layer adjoins the main surface at least regionally between the domains.