Semiconductor Package Modular Expansion via Redistribution Element
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Solution Overview
Problem
Existing stacked multi-chip modules (MCMs) are not expandable, requiring replacement of the entire package for upgrades or when a semiconductor die fails, leading to wastage of functional components and resources.
Innovation Solution
A semiconductor device package design with a redistribution element and apertures in the encapsulant that expose contact pads, allowing for the connection and upgrade or repair of additional semiconductor devices without replacing the entire package, enabling modular expansion and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire semiconductor package is replaced when a die fails or for upgrades, then functionality is restored or improved, but resource wastage increases and cost increases
Solution Approach 1:
The semiconductor package is segmented into replaceable components: the carrier substrate with functional dies that can be retained, and the failed or obsolete die that can be individually replaced. The carrier substrate acts as a reusable platform, while individual dies are modular replacement units, allowing selective replacement rather than replacing the entire package.
Solution Approach 2:
The invention enables recovery and reuse of the carrier substrate and functional dies by discarding only the failed or obsolete die. The carrier substrate with remaining functional dies is recovered and reused, significantly reducing resource wastage compared to replacing the entire package.
2Adaptability or versatility
If the entire semiconductor package is replaced for upgrades, then functionality is improved, but cost increases
Solution Approach 1:
The package is divided into a reusable carrier substrate and replaceable die modules. This segmentation enables selective replacement of only the die that needs upgrading, while the carrier substrate and other functional dies are retained, reducing upgrade costs.
Solution Approach 2:
The carrier substrate is designed with universal compatibility to support different types of dies. The same carrier substrate can accommodate various die types and configurations, allowing flexible upgrades and adaptations without requiring a new package platform, thereby reducing costs.
3Ease of manufacture
If conventional semiconductor packages are used, then manufacturing is simple, but expandability is limited
Solution Approach 1:
The package structure is segmented into a reusable carrier substrate and replaceable die modules. This segmentation enables easy expansion by adding or replacing individual dies on the existing carrier substrate without requiring complex re-manufacturing of the entire package.
Solution Approach 2:
The package is designed with dynamic reconfigurability, allowing the die configuration on the carrier substrate to be changed or expanded. The carrier substrate maintains electrical and mechanical connectivity while permitting die replacement and reconfiguration, enabling flexible expansion while maintaining manufacturing simplicity.
Data Source
AI summary
A semiconductor device package includes a carrier, one or more semiconductor devices on the carrier, and a redistribution element above the uppermost of the one or more semiconductor devices. The redistribution element includes an array of contact pads that communicate with each semiconductor device of the package. The package may also include an encapsulant through which the contact pads of the redistribution element are at least electrically exposed. Methods for assembling and packaging semiconductor devices, as well as methods for assembling multiple packages, including methods for replacing the functionality of one or more defective semiconductor devices of a package according to embodiments of the present invention, are also disclosed.