Semiconductor Module Bonding Structure to Contain Adhesive Overflow
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Solution Overview
Problem
Existing semiconductor modules face issues with adhesive overflow onto electronic components due to insufficient bonding between the substrate and case, leading to potential malfunctions.
Innovation Solution
A semiconductor module design featuring projecting parts on the case and substrate surfaces with separated end surfaces and recessed areas to contain adhesive, utilizing inclined surfaces and additional projecting parts as dams to prevent overflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If recesses and projections are provided on the substrate and case to improve adhesion, then bonding strength is improved, but adhesive may overflow onto the mounting portion causing malfunctions
Solution Approach 1:
The bonding interface is segmented into multiple functional zones: a bonding portion with recesses and projections for strong adhesion, and a separate mounting portion kept at a distance to prevent adhesive overflow. The projecting part acts as a barrier structure that segments the adhesive flow path, confining it to the bonding area.
Solution Approach 2:
An adhesive portion is introduced as an intermediary substance between the projecting part and the mounting portion. This adhesive layer fills the gap created by the separated end surface of the projecting part, preventing direct contact and potential overflow onto the mounting portion while maintaining bonding integrity.
2Stability of the object's composition
If the end surface of the projecting part contacts the substrate or case, then bonding is achieved, but adhesive overflows onto the mounting portion
Solution Approach 1:
The design transitions from a two-dimensional contact surface to a three-dimensional structured interface with vertical separation. The end surface of the projecting part is separated from the mounting portion in the vertical dimension, creating a gap that confines adhesive to the bonding portion while maintaining horizontal bonding integrity through the recesses and projections.
Solution Approach 2:
The gap between the end surface of the projecting part and the mounting portion is pre-formed during manufacturing, before adhesive application. This preliminary structural arrangement ensures that adhesive is confined to the bonding portion and cannot overflow onto the mounting portion, eliminating the need for precise adhesive placement control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents adhesive from overflowing onto electronic components, ensuring reliable bonding and preventing malfunctions by containing excess adhesive within designated spaces.
Implementation Method 1
the substrate and the case are bonded together with an adhesive
Data Source
Figure 1(a)~2
Figure 3(a)~4
Figure 5~6
AI summary
[PROBREM] To provide a semiconductor module that can prevent an adhesive from overflowing onto a mounting portion of an electronic component on a substrate when bonding a case to the substrate. [SOLUTION] The semiconductor module of the present invention is the semiconductor module in which a case 20 is attached to a substrate 10 and the substrate 10 is sealed with resin, wherein a first projecting part 31 is provided on at least one of an opposite surface 20A of the case 20 facing the substrate 10 and an opposite surface 10A of the substrate 10 facing the case 20, and wherein an end surface 31A of the first projecting part 31 is separated from the opposite surface 20A of the case 20 or the opposite surface 10A of the substrate 10 and a separated portion serves as an adhesive portion 50 with an adhesive 40 interposed therebetween.