Semiconductor Module Adhesive Joint Insulation Strength
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Solution Overview
Problem
Conventional semiconductor modules face issues with air bubbles in adhesives reducing insulation strength and complex structures requiring deep protrusions and recesses, which can lead to gaps and further insulation failures.
Innovation Solution
A semiconductor module design featuring a base plate with a recess or protrusion on its upper surface between the case and semiconductor chip, joined with an adhesive, which prevents air bubbles and ensures high insulation strength by maintaining a simple structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is filled in a groove on the base plate to join the case, then the case and base plate are fixed together, but air bubbles remain in the adhesive causing reduced insulation strength
Solution Approach 1:
The recess is formed on the upper surface of the base plate before applying the adhesive. This preliminary structural preparation allows the adhesive to be applied without forming a deep groove, enabling air bubbles to escape during the joining process while maintaining proper adhesion between the case and base plate, thereby preserving insulation strength.
2Ease of manufacture
If protrusion and recess are formed to fix the case and base plate without adhesive, then the structure becomes complex and requires deep grooves, but this prevents sealing resin from extending properly causing gaps and reduced insulation strength
Solution Approach 1:
The invention combines the adhesive joining method with a shallow recess structure, merging the benefits of chemical bonding with mechanical interlocking. This eliminates the need for deep protrusions and recesses required in adhesive-free designs, simplifying the overall structure while maintaining effective case-to-base-plate fixation and allowing proper sealing resin extension.
3Reliability
If deep protrusion and recess are used to fix case and base plate, then adhesive-free joining is achieved, but sealing resin cannot extend into deep grooves producing gaps
Solution Approach 1:
The invention changes the depth parameter of the recess from deep (as required in protrusion-recess fitting methods) to shallow, positioned on the upper surface of the base plate. This parameter modification allows the sealing resin to properly extend into the recess without being blocked by deep groove structures, ensuring complete coverage and maintaining insulation performance while still providing mechanical support for the adhesive joining.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a simple structure with high insulation strength by preventing air bubbles and reducing gaps, thereby enhancing the module's sealing performance and allowing for miniaturization and operation at high temperatures.
Implementation Method 1
a case joined to the outer periphery of the base plate with an adhesive
Data Source
AI summary
Provided is a semiconductor module in which a case and a base plate joined together with a simple structure, the semiconductor module having high insulation strength. The semiconductor module includes the following: a base plate; at least one semiconductor chip disposed inside the base plate other than the outer periphery of the base plate and above the base plate; and a case joined to the outer periphery of the base plate with an adhesive, and containing the at least one semiconductor chip. The upper surface of the base plate is provided with a recess or a protrusion between an inner wall of the case and the at least one semiconductor chip in a plan view.