Thermally Anisotropic Member for Semiconductor Module Heat Dissipation
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Solution Overview
Problem
The existing semiconductor module designs face issues with heat damage to insulating paper during laser welding, which can lead to electrical defects and reduced reliability due to excessive temperature rise, compromising the insulation between P and N terminals.
Innovation Solution
Incorporating a thermally anisotropic member with higher thermal conductivity in the planar direction between the insulating member and the second terminal, which helps in dissipating heat away from the insulating sheets, thereby preventing damage and maintaining insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser welding is used to join the bus bar to the P terminal and N terminal, then the electrical connection is improved, but the insulating paper may become damaged by heat caused by the laser
Solution Approach 1:
A heat transfer probe is introduced as an intermediary component between the laser welding zone and the insulating paper. The probe absorbs and conducts heat away from the insulating paper, preventing thermal damage while allowing the laser welding process to proceed. This mediator resolves the contradiction by decoupling the welding heat source from the heat-sensitive insulating material.
Solution Approach 2:
The harmful heat effect is extracted and redirected away from the insulating paper by the heat transfer probe. The probe selectively removes thermal energy from the welding zone and transports it to a safe location, separating the beneficial welding function from the harmful thermal effect on the insulating paper.
2Temperature
If a heat transfer probe is placed near the welding location to remove heat, then excessive temperature rise of welded portions is suppressed, but the insulating paper may still become damaged by laser heat
Solution Approach 1:
The heat transfer probe serves as a thermal intermediary that intercepts heat flow before it reaches the insulating paper. By positioning the probe between the laser source and the insulating paper, it creates a thermal barrier that protects the paper while still allowing the welding process to occur.
Solution Approach 2:
The harmful laser heat is converted into a beneficial thermal conduction path through the heat transfer probe. The probe transforms the potentially damaging radiant heat into controlled conductive heat flow that can be managed and directed away from sensitive components, turning a harmful effect into a controllable process parameter.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses heat propagation to the insulating sheets, preventing damage and ensuring reliable insulation between the P and N terminals, thus enhancing the semiconductor module's reliability and preventing electrical defects.
Implementation Method 1
the thermally anisotropic member having a thermal conductivity that is higher in a planar direction perpendicular to the laminating direction than in the laminating direction
Implementation Method 2
the thermally anisotropic member having a thermal conductivity that is higher in a planar direction perpendicular to the laminating direction than in the laminating direction
Implementation Method 3
The P terminal, the N terminal, and the bus bar are connected by laser welding
Implementation Method 4
the heat of the laser
Data Source
AI summary
A semiconductor module, including: a terminal laminated portion having a first terminal, an insulating member, and a second terminal that are laminated in that order to one another in a laminating direction; and a thermally anisotropic member disposed between the insulating member and the second terminal, the thermally anisotropic member having a thermal conductivity that is higher in a planar direction perpendicular to the laminating direction than in the laminating direction.