Semiconductor Module Asymmetric Power Device Layout

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Solution Overview

Problem

Conventional semiconductor modules with stacked high calorific value devices face issues of increased thickness, leading to heat duplication and accumulation, which complicates heat management.

Innovation Solution

A semiconductor module design featuring a first and second member with power devices positioned opposite each other, connected via a conductor column, and shifted on the horizontal plane, with reduced conductor layers in the vertical direction, utilizing a sealing resin to cover the components and a heat sink with a recessed part for improved heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If devices with high calorific value are stacked in a conventional opposing manner, then the semiconductor module can be compact, but heat accumulates due to duplication of heat from both devices and increased sealing resin volume

Engineering Contradiction:

Improvemodule thicknessVSAvoidheat accumulation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent applies asymmetry by shifting the horizontal positions of the first and second power devices relative to each other, so they are not directly opposite. This asymmetric arrangement creates thermal separation while maintaining compact vertical stacking, allowing heat from each device to dissipate to different regions rather than accumulating in the same area.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent transitions from a conventional two-dimensional opposing arrangement to a three-dimensional asymmetric configuration. By shifting devices in the horizontal plane while maintaining vertical stacking, the design utilizes the third dimension to achieve both compactness and improved heat dissipation by directing heat flow to different spatial zones.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If connection parts are disposed opposite to each other for connecting conductor layers, then electrical connection is simplified, but the module thickness increases and more sealing resin is required

Engineering Contradiction:

Improveconnection simplicityVSAvoidmodule thickness

Core Design Contradiction:

Ease of manufactureVSLength of stationary object

Solution Approach 1:

The patent applies asymmetry by shifting the horizontal positions of connection parts corresponding to different devices. This asymmetric arrangement allows connection parts to be offset rather than directly opposite, reducing the vertical space required while maintaining effective electrical connections through the conductor layers.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively downsizes the semiconductor module in the vertical direction, reduces heat accumulation, and enhances heat radiation performance by shifting power devices on the horizontal plane and using a heat sink with a lubricant for efficient heat transfer.

Implementation Method 1

a conductor column extending in the vertical direction between the first member and the second member... the first high heating surface and the second high heating surface are disposed opposite to each other and connected via the conductor column

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a sealing resin covering the first conductor layer, the first power device, the second conductor layer, the second power device and the conductor column

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 3

a heat sink provided with a recessed part for receiving the semiconductor module

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 4

enhances heat radiation performance by shifting power devices on the horizontal plane and using a heat sink with a lubricant for efficient heat transfer

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 5

using a heat sink with a lubricant for efficient heat transfer

Methodology Applied

Scientific EffectThermal conduction enhancement: Lubrication

Data Source

PatentUS9997437B2Power semiconductor module for improved thermal performance

Publication Date: 2018.06.12 SHINDENGEN ELECTRIC MANUFACTURING CO LTD

AI summary

Semiconductor module has a first member, a second member, a conductor column extending in the vertical direction between the first member and the second member and a sealing resin covering a first conductor layer and a first power device of the first member, a second conductor layer and a second power device of the second member and the conductor column. Positions of the first power device and the second power device on the horizontal plane are shifted, the second conductor layer is not provided in the vertical direction from a first connection part connected to the first power device, and the first conductor layer is not provided in the vertical direction from a second connection part, connected to the second power device, of the second power device.