Semiconductor Module Bent Gaps Wiring Warp
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Solution Overview
Problem
Conventional semiconductor modules experience wiring line warp and water ingress due to linear gaps between central wiring lines, which compromise their structural integrity and sealing effectiveness.
Innovation Solution
A semiconductor module design featuring bent gaps between central wiring lines on the substrate, with a sealing member covering the power supply lines, ground lines, and half bridges to prevent warp and water entry, while optimizing the layout of control signal terminals and thermistor placement for improved switch controllability and reduced noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If linear gaps are disposed between central wiring lines, then the wiring lines can be simply arranged, but the wiring lines warp in the longitudinal direction and water can easily enter the semiconductor module
Solution Approach 1:
The linear gaps between central wiring lines are transformed into bent gaps that extend in a bent shape rather than a straight line. This curvature in the gap configuration prevents the wiring lines from warping while maintaining the necessary spacing, and simultaneously improves water resistance by disrupting the linear path that water could follow into the semiconductor module.
2Area of stationary object
If central wiring lines are disposed between power supply line and ground line, then the module structure is compact, but water entry path is shortened due to linear gaps
Solution Approach 1:
By configuring the gaps between central wiring lines as bent gaps rather than linear gaps, the invention maintains the compact module structure while effectively blocking the water entry path. The bent configuration disrupts the continuous linear path that water could follow, thereby improving sealing effectiveness without increasing module size.
3Device complexity
If linear gaps extend in lateral direction, then wiring layout is simple, but structural integrity deteriorates due to wiring warp
Solution Approach 1:
The invention transforms the simple linear gap configuration into a bent gap configuration. While this increases layout complexity slightly, it successfully prevents wiring line warping and maintains structural integrity. The bent gaps provide a more stable foundation for the wiring lines, preventing deformation while still allowing for practical manufacturing.
Data Source
AI summary
A semiconductor module is configured to convert a direct current to a three-phase alternating current, and to supply the three-phase alternating current to a three-phase motor to drive the three-phase motor, wherein a first gap M1 between side surfaces of the first and the second central wiring lines, which side surfaces are close to each other and face each other, and a second gap M2 between side surfaces of the second and the third central wiring lines, which side surfaces are close to each other and face each other, are bent on the top surface of the substrate.