Power Semiconductor Module Connection Layout for Stable Board Coupling
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Solution Overview
Problem
Existing power semiconductor module arrangements face challenges in achieving stable electrical connections between semiconductor substrates and electronic boards or metal sheets, leading to potential failures and reduced lifetime.
Innovation Solution
A power semiconductor module arrangement is designed with a semiconductor substrate housed in a module, where an electronic board or metal sheet is arranged parallel to the substrate, and electrical connections with a first and second end, and an intermediate section, are mechanically coupled to both the substrate and the electronic board or metal sheet, forming a stable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldering or sintering techniques are used to mount semiconductor elements on substrates, then electrical connections can be established, but the stability and reliability of connections between substrates and electronic boards deteriorate
Solution Approach 1:
The electrical connection is divided into three distinct sections: a first end section mechanically coupled to the electronic board, an intermediate section extending between the ends, and a second end section mechanically coupled to the semiconductor substrate. This segmentation allows each section to be optimized for its specific function, improving overall connection reliability while maintaining manageable structural complexity
Solution Approach 2:
The electrical connection transitions from traditional planar mounting to a three-dimensional configuration with an intermediate section that extends spatially between the electronic board and semiconductor substrate. This dimensional change enables improved mechanical coupling and connection stability without proportionally increasing overall device complexity
2Reliability
If multiple redundant electrical connections are implemented to ensure stability, then connection reliability improves, but device complexity and space requirements increase
Solution Approach 1:
The intermediate section of the electrical connection serves multiple functions simultaneously: it provides mechanical support, establishes electrical continuity, and enables spatial flexibility for routing. This multi-functionality achieves reliable connections without requiring additional redundant connection structures, thereby reducing space requirements
Solution Approach 2:
The electrical connection's geometry is optimized by varying parameters such as the length, shape, and positioning of the intermediate section. These parameter changes allow the single connection to achieve adequate stability and reliability without needing redundant connections, thus reducing the area occupied in the module
Data Source
Figure 1~2
Figure 3~4B
Figure 4C~5
AI summary
A power semiconductor module arrangement comprises a semiconductor substrate (10) arranged in a housing (5), the semiconductor substrate (10) having one or more elements mounted thereon, an electronic board or metal sheet (7) arranged in the housing (5) distant from the semiconductor substrate (10), wherein the electronic board or metal sheet (7) is arranged in parallel to the semiconductor substrate (10), and at least one electrical connection (42), configured to electrically couple the electronic board or metal sheet (7) to the semiconductor substrate (10) or to one of the elements mounted thereon, wherein each of the at least one electrical connection (42) comprises a first end (421) and a second end (422), and an intermediate section extending between the first end (421) and the second end (422), and wherein the first end (421) and the second end (422) of each electrical connection (42) are mechanically coupled to the electronic board or metal sheet (7), and a middle section (423) of the intermediate section is mechanically coupled to the semiconductor substrate (10) or to one of the elements mounted thereon.