Semiconductor module

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Solution Overview

Problem

There is a demand for energy-saving, sophisticated, and smaller electronic devices, necessitating improved performance and reduced size of semiconductor modules, while also requiring better heat dissipation properties and prevention of peeling between conductive and supporting substrates.

Innovation Solution

A semiconductor module configuration featuring a supporting substrate, conductive substrate, and a first conductive bonding member with a metal-based first base layer and second layer, directly bonded to the conductive and supporting substrates, respectively, to enhance heat dissipation and prevent peeling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional single-layer conductive bonding member is used, then the structure is simple, but the heat dissipation property is insufficient and peeling occurs between substrates

Engineering Contradiction:

Improveheat dissipation propertyVSAvoidbonding member structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The conductive bonding member is constructed as a multi-layer composite structure consisting of a first conductive bonding layer (e.g., Cu or Al), a second conductive bonding layer (e.g., Ag or Au), and an insulating layer. This composite structure combines materials with different thermal and electrical properties to achieve superior heat dissipation while preventing substrate peeling through optimized interfacial bonding.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The bonding member is segmented into multiple functional layers: the first conductive bonding layer provides electrical connection and initial thermal conduction, the second conductive bonding layer enhances thermal conductivity and provides corrosion resistance, and the insulating layer prevents electrical shorting while allowing thermal transfer. This segmentation allows each layer to optimize its specific function.

Inventive Principle:

Principle #1Segmentation

2Volume of moving object

If the module size is reduced to meet demand for smaller electronic devices, then the device becomes more compact, but heat dissipation becomes more difficult

Engineering Contradiction:

Improvemodule sizeVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The invention changes the thermal conductivity parameter of the bonding structure by introducing high-thermal-conductivity materials (such as Ag or Au in the second conductive bonding layer) and optimizing the thickness parameters of each layer. This allows efficient heat dissipation in a compact volume by maximizing the thermal performance per unit volume through careful parameter selection.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If conventional bonding methods are used, then the manufacturing process is simple, but peeling occurs between the conductive substrate and supporting substrate

Engineering Contradiction:

Improvebonding reliabilityVSAvoidbonding member structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The multi-layer composite bonding member provides enhanced bonding reliability through the synergistic combination of materials. The first conductive layer ensures good electrical contact, the second conductive layer provides strong adhesion and corrosion resistance, and the insulating layer maintains electrical isolation while allowing thermal coupling. This composite structure prevents peeling by distributing mechanical and thermal stresses across multiple interfaces.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The configuration improves heat dissipation properties and prevents peeling between the conductive and supporting substrates, supporting the development of smaller and more efficient semiconductor modules.

Implementation Method 1

The first conductive bonding member has a first base layer made of metal, a first layer, and a second layer... improving the heat dissipation property

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The first layer is provided between the first base layer and the conductive substrate and bonded in direct contact with the conductive substrate at a bonding interface with the conductive substrate. The second layer is provided between the first base layer and the supporting substrate and bonded in direct contact with the supporting substrate at a bonding interface with the supporting substrate.

Methodology Applied

Scientific EffectMetal bonding: Welding

Data Source

PatentUS12406908B2Semiconductor module

Publication Date: 2025.09.02 ROHM CO LTD

AI summary

A semiconductor module includes a supporting substrate, a conductive substrate supported by the supporting substrate, a conductive bonding member provided between the supporting substrate and the conductive substrate, and a semiconductor element electrically bonded to an obverse surface of the conductive substrate and having a switching function. The conductive bonding member includes a metal base layer, a first layer, and a second layer. The first layer is provided between the base layer and the conductive substrate, and is in direct contact with the conductive substrate. The second layer is provided between the base layer and the supporting substrate, and is in direct contact with the supporting substrate.