Power Semiconductor Module Thermal Management
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Solution Overview
Problem
Existing power semiconductor modules face challenges in cost-effective production and spatial restrictions while maintaining effective cooling, particularly in high-integrated applications like electric vehicle drivetrains, where efficient heat dissipation is crucial for performance and reliability.
Innovation Solution
A power semiconductor module design featuring a substrate with integrated capacitors thermally connected to a heat dissipator extending through the substrate, combined with an encapsulation material that includes external cooling structures and a cooling channel for efficient heat removal, allowing for effective cooling from both the lower and upper sides without increasing spatial requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electrolyte capacitors are arranged on the substrate in embedded technology, then the required capacitances can be accommodated, but additional expenditure with regard to substrate size is incurred
Solution Approach 1:
The patent transitions from planar arrangement of capacitors on the substrate surface to a three-dimensional configuration where capacitors are mounted on the side surfaces of the housing. This vertical stacking approach allows capacitance requirements to be met without increasing the substrate area, effectively utilizing the housing volume for component mounting.
Solution Approach 2:
The capacitors are nested within the housing structure by mounting them on the side surfaces of the housing rather than requiring additional substrate area. This nesting approach integrates the capacitor arrangement into the existing housing volume, eliminating the need for extra substrate space.
2Temperature
If cooling channels are added for effective cooling, then thermal management improves, but device complexity increases
Solution Approach 1:
The housing serves multiple functions simultaneously: it provides mechanical protection for the electronic components, acts as a thermal management structure through integrated cooling channels, and serves as a mounting structure for capacitors on its side surfaces. This multi-functionality reduces overall device complexity despite improved cooling capabilities.
Solution Approach 2:
The cooling channels are merged with the housing structure itself rather than being separate components. The housing walls incorporate cooling channels directly, combining the protective housing function with the cooling function in a single integrated structure, thereby reducing device complexity.
3Temperature
If heat dissipators are added for thermal contact with capacitors, then thermal management improves, but device complexity increases
Solution Approach 1:
The housing walls serve dual purposes: providing mechanical protection and serving as heat dissipators through thermal contact with capacitors mounted on their outer surfaces. This eliminates the need for separate heat dissipator components, reducing device complexity while maintaining effective thermal management.
Solution Approach 2:
The housing structure merges the protective enclosure function with the heat dissipation function. The outer surfaces of the housing walls that contact the capacitors act as heat dissipators, combining structural support and thermal management in a single integrated component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances producibility, reduces costs, and improves thermal management, leading to better performance and extended service life by enabling efficient heat dissipation with reduced component complexity and space usage, suitable for high-performance applications in electric vehicles.
Implementation Method 1
the at least one capacitor (26) is fastened on the busbars and is in thermal contact in the sense of heat conduction with a heat dissipator (28) extending through the substrate (12)
Implementation Method 2
at least one power semiconductor component (16) is cooled by a cooling channel (40) for a cooling fluid
Data Source
AI summary
Various embodiments of the teachings herein include a power semiconductor module. An example may include: a substrate; an electric circuit arranged on the substrate; a conductor frame including a DC+ busbar and a DC− busbar for external contacts; and an encapsulation material at least partially encapsulating the power semiconductor module. The electric circuit includes a power semiconductor component and a capacitor fastened on the busbars in thermal contact with a heat dissipator extending through the substrate.