Power Semiconductor Module Layout for Low-Inductance Capacitor Wiring
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Solution Overview
Problem
The existing power conversion devices have long wiring paths that result in high inductance, which cannot be effectively reduced, especially when considering the capacitor wiring path.
Innovation Solution
A power semiconductor device design that includes a substrate with integrated capacitors between upper-arm and lower-arm circuit bodies, where positive and negative electrode wirings face each other on opposite surfaces of the substrate, reducing the wiring path length and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the capacitor is placed outside the power semiconductor device, then the device structure is simpler, but the wiring path becomes long and inductance increases
Solution Approach 1:
The patent merges the capacitor with the power semiconductor device by integrating it into the module housing. The capacitor is positioned adjacent to the circuit board within the same housing, creating a unified power conversion device assembly. This combining approach shortens the wiring path between the capacitor and the circuit board while maintaining structural simplicity through a integrated module design.
2Ease of manufacture
If the wiring path is made long to accommodate external capacitor placement, then manufacturing is easier, but inductance of the wiring path increases
Solution Approach 1:
The patent transitions from a planar wiring arrangement to a three-dimensional spatial configuration. The capacitor is positioned in a different spatial plane adjacent to the circuit board, with wiring paths routed through vertical and lateral dimensions within the module housing. This dimensional change allows for shorter overall wiring paths while maintaining ease of manufacturing through standardized module assembly techniques.
3Length of stationary object
If the capacitor is integrated within the power semiconductor device housing, then wiring path length is reduced, but device complexity increases
Solution Approach 1:
The patent segments the power conversion device into distinct functional modules: a circuit board containing switching elements, a separate capacitor component, and a housing that integrates them. The circuit board is positioned vertically with switching elements mounted on it, while the capacitor is placed adjacent to the board within the housing. This segmentation allows for modular assembly and reduced wiring paths while keeping the overall device structure organized and manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the inductance of the wiring path by shortening the distance between switching elements and capacitors, enhancing current flow efficiency and magnetic flux cancellation.
Implementation Method 1
a first capacitor that smooths DC power supplied to the first upper-arm circuit body and the first lower-arm circuit body
Implementation Method 2
a substrate in which a positive electrode wiring connected to the first conductor on a high potential side and a negative electrode wiring connected to the fourth conductor on a low potential side are provided on one surface, and an output wiring connected to the second conductor and the third conductor is provided on the other surface
Data Source
AI summary
A power semiconductor device includes: a substrate in which a positive electrode wiring connected to a first conductor on a high potential side and a negative electrode wiring connected to a fourth conductor on a low potential side are provided on one surface, and an output wiring connected to a second conductor and a third conductor is provided on the other surface so as to face the positive electrode wiring and the negative electrode wiring; and a first capacitor that smooths DC power supplied to a first upper-arm circuit body and a first lower-arm circuit body. The substrate is disposed between the first upper-arm circuit body and the first lower-arm circuit body. The first capacitor is disposed between the first upper-arm circuit body and the first lower-arm circuit body, and is connected to the positive electrode wiring and the negative electrode wiring on the substrate.