Semiconductor Module Case Positioning for Simpler Assembly
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Solution Overview
Problem
The complexity of the housing configuration in semiconductor modules, with multiple protrusions on the upper and lower surfaces, leads to increased costs and complicates assembly and attachment processes.
Innovation Solution
A semiconductor module design featuring a metal base plate with a semiconductor unit mounted on it, surrounded by a case with a protrusion for positioning and a hole or cutout for overlap, simplifying the configuration and integrating positioning functions for both assembly and attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple protrusions are provided on the upper and lower surfaces of the housing for positioning, then positioning accuracy is improved, but the housing shape becomes complicated and cost increases
Solution Approach 1:
The patent combines multiple positioning functions into a single integrated positioning structure. Instead of providing separate protrusions on both upper and lower surfaces of the housing, the invention uses one positioning protrusion on the housing that engages with a corresponding positioning hole in the heat sink, achieving accurate positioning while simplifying the housing shape and reducing manufacturing complexity.
2Manufacturing precision
If multiple protrusions are provided on the housing for positioning, then positioning accuracy is improved, but assembly and attachment work becomes more complicated
Solution Approach 1:
The patent merges multiple positioning operations into a single engagement action. The positioning protrusion on the housing engages with the positioning hole in the heat sink in one straightforward motion, eliminating the need for multiple alignment and insertion steps that would be required if separate protrusions were used on both surfaces.
3Manufacturing precision
If multiple protrusions are provided on the housing for positioning, then positioning accuracy is improved, but manufacturing cost increases
Solution Approach 1:
The patent reduces the number of positioning features from multiple protrusions on both housing surfaces to a single positioning protrusion on the housing. This simplification reduces mold complexity, material usage, and manufacturing steps, thereby lowering production costs while maintaining adequate positioning accuracy through the single engaged connection with the heat sink.
Data Source
AI summary
A semiconductor module a metal base plate having a semiconductor unit including a semiconductor element, the metal base plate having an upper surface and a bottom surface opposite to each other and the semiconductor element being mounted on the upper surface, and a case surrounding a periphery of the semiconductor unit and being bonded to the upper surface of the metal base plate. The case includes a first positioning portion formed by a protrusion protruding a bottom of the case toward the metal base plate, and a second positioning portion formed by a hole or a cutout so as to at least partially overlap with the first positioning portion in a plan view of the semiconductor module. The metal base plate includes a first engagement portion formed by a hole or a cutout with which the first positioning portion is engageable.