Semiconductor Module Case Terminal Sealing

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Solution Overview

Problem

Existing semiconductor modules are prone to damage when used in corrosive gas atmospheres due to inadequate sealing of terminal holes, leading to gas ingress and potential damage.

Innovation Solution

A semiconductor module design that includes a case with terminal holes, external terminals inserted into specific holes, and a spacer bonded to the case using an adhesive, with partitions between terminal holes to ensure uniform adhesive distribution and sealing, preventing corrosive gas entry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive is applied to bond the case and terminal pressing frame, then the bonding strength is improved, but the adhesive spreads unevenly in terminal holes due to partitions, reducing sealing quality

Engineering Contradiction:

Improvebonding strengthVSAvoidsealing uniformity

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The terminal pressing frame is divided into multiple independent pressing portions, each corresponding to a specific terminal hole. This segmentation allows the adhesive to be applied and pressed uniformly into each terminal hole individually, overcoming the uneven spread caused by partitions between holes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The terminal pressing frame acts as an intermediary tool that mediates the adhesive application process. By pressing the adhesive into the terminal holes through the pressing portions, it ensures uniform distribution and proper sealing of each hole while maintaining bonding strength.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If partitions are added between terminal holes to guide adhesive, then sealing uniformity is improved, but the complexity of the case structure increases

Engineering Contradiction:

Improvesealing uniformityVSAvoidcase structure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The case is segmented into multiple terminal holes with partitions between them, creating distinct channels for adhesive flow. This segmentation ensures that adhesive is directed into each terminal hole uniformly without mixing between adjacent holes, improving sealing consistency.

Inventive Principle:

Principle #1Segmentation

3Adaptability or versatility

If terminal holes are left open for versatility, then adaptability is improved, but corrosive gas can enter and damage the semiconductor module

Engineering Contradiction:

Improvecase adaptabilityVSAvoidcorrosive gas ingress

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

Adhesive is applied in advance to seal the terminal holes before the semiconductor module is installed or exposed to corrosive environments. This preliminary sealing action prevents corrosive gas from entering through the terminal holes while maintaining the case's versatility for different applications.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The adhesive, which could be considered a filler material, is converted into a protective sealing element. By filling and sealing the terminal holes, the adhesive transforms the potential harm of open holes (gas ingress) into a benefit (protection against corrosive gas) while maintaining structural integrity.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively seals terminal holes, preventing corrosive gas ingress and enhancing the longevity of the semiconductor module in corrosive environments.

Implementation Method 1

The case and the spacer are bonded to each other by an adhesive

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

The terminal pressing frame presses the external terminals toward the case

Methodology Applied

Scientific EffectMechanical pressing: Mechanical Force

Data Source

PatentUS20230187293A1Semiconductor module, method of manufacturing semiconductor module, and case unit

Publication Date: 2023.06.15 FUJI ELECTRIC CO LTD

AI summary

A semiconductor module includes: a semiconductor element; a laminated substrate including a circuit substrate on which the semiconductor element is mounted; a case including a plurality of terminal holes, the case housing the semiconductor element; a plurality of external terminals, each external terminal being inserted into one of two or more terminal holes among the plurality of terminal holes, the plurality of external terminals being electrically connected to the semiconductor element; and a spacer interposed between the laminated substrate and the case. The case and the spacer are bonded to each other by an adhesive. The case includes, for each two adjacent terminal holes among the plurality of terminal holes, a partition between the two adjacent terminal holes. A distance between the first bonding surface and the partition is greater than a thickness of each external terminal.