Semiconductor Module Mechanical Clamping and Wiring Layout
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Solution Overview
Problem
Semiconductor devices experience stress due to thermal expansion, which reduces their lifespan, and existing solutions require complex wiring configurations for installation.
Innovation Solution
A semiconductor module design that fixes the semiconductor device using pressure between conductive members without brazing materials, featuring a cylinder with thread grooves for easy assembly and reduced stress, and a configuration that allows for simpler wiring installation by positioning conductive members without the need for complex connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If brazing material such as solder is used to join semiconductor device to wiring, then connection strength is improved, but stress is applied to semiconductor device during thermal expansion which reduces device life
Solution Approach 1:
The invention removes the brazing material (solder) from the connection structure entirely. Instead of joining the semiconductor device to wiring through solder, the patent uses a direct mechanical pressing connection where the semiconductor device is pressed between a first electrode plate and a second electrode plate, eliminating the harmful thermal expansion stress that brazing materials impose on the device
Solution Approach 2:
The invention replaces the thermal-mechanical joining method (brazing/soldering) with a purely mechanical pressing system. The semiconductor device is fixed through direct mechanical pressure between electrode plates, substituting the chemical-thermal bonding process with a mechanical constraint system that avoids thermal expansion compatibility issues
2Reliability
If positive plate is arranged on lower surface and negative plate on upper surface, then electrical connection is achieved, but wiring becomes complicated requiring connections to both upper and lower surfaces
Solution Approach 1:
The invention rearranges the electrical connection layout by extending the third conductive member (negative wiring) along the first conductive member (positive wiring) in a linear arrangement. This dimensional reorganization allows both positive and negative connections to be accessed from the same side (upper surface), transforming the vertical/dual-sided connection requirement into a horizontal/single-sided connection layout
Solution Approach 2:
The invention merges the third conductive member with the first conductive member by having the third member extend along the first member. This merging of spatial paths allows both conductive members to be positioned on the upper surface, combining what were previously separate upper and lower surface connections into a unified single-sided connection interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces stress on semiconductor devices during thermal expansion, enabling longer device life and simplifies the installation process with easier wiring connections, maintaining low inductance and compact size.
Implementation Method 1
When a semiconductor device generates heat
Implementation Method 2
the semiconductor device and peripheral members thereof (solder, wiring, and the like) thermally expand
Implementation Method 3
The first conductive member is electrically connected to the first electrode of the semiconductor device. In addition, the third conductive member is electrically connected to the second electrode of the semiconductor device via the second conductive member
Implementation Method 4
The insulating member provides insulation between the first conductive member and the third conductive member
Data Source
AI summary
A semiconductor module includes a semiconductor having a semiconductor substrate, a first electrode formed on one surface of the semiconductor substrate, and a second electrode formed on an opposite surface of the semiconductor substrate. A first conductive member is in contact with the first electrode. A second conductive member is in contact with the second electrode. A third conductive member is in contact with the second conductive member and extends along the first conductive member. An insulating member provides insulation between the first conductive member and the third conductive member. The third conductive member is fixed to the first conductive member and the second conductive member by being sandwiched between the first conductive member and the second conductive member. The semiconductor device is fixed to the first conductive member and the second conductive member by being sandwiched between the first conductive member and the second conductive member.