Semiconductor Module Clip Layout for External Current and Heat Paths
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Solution Overview
Problem
Existing semiconductor modules face challenges with high power dissipation densities, space requirements, and reliability issues due to current constrictions and heat dissipation limitations, particularly in half-bridge circuits and mold packages.
Innovation Solution
A semiconductor module design featuring a metallic connecting clip between two semiconductor components, with an exposed contact point and a contact element outside the housing, allowing current and heat paths outside the substrate, and incorporating a heat sink for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current paths are routed through the substrate or circuit board, then electrical connection is established, but power dissipation densities increase and reliability decreases due to heat and current constrictions
Solution Approach 1:
The patent extracts the current path from the substrate/circuit board interior and routes it through exposed contact surfaces on the housing. The connecting clips and contact elements are positioned to conduct current externally, removing the harmful current constriction from the substrate and eliminating the associated heat generation and reliability risks.
Solution Approach 2:
The patent transitions the current path from a planar routing through the substrate to a three-dimensional external routing through exposed contact surfaces on the housing. This dimensional change allows current to flow through air space and external metal paths rather than being constrained within the substrate plane, reducing power dissipation density.
2Area of stationary object
If all contacts are arranged in a single contact level on the carrier substrate, then interconnection is simplified, but space requirements increase and heat dissipation capability is limited
Solution Approach 1:
The patent utilizes multiple contact levels by positioning contact elements on the housing surface at different heights and locations. The connecting clips extend vertically from the substrate to contact elements on the housing, creating a multi-level contact architecture that consolidates multiple electrical connections into a compact footprint while improving heat dissipation through external paths.
3Adaptability or versatility
If semiconductor components are arranged with electrodes in different planes, then connection flexibility increases, but additional current constriction points are created within the housing
Solution Approach 1:
The patent extracts the current path from the interior of the housing where constriction would occur and routes it through exposed contact surfaces on the external housing. The connecting clips are designed to bridge electrodes in different planes while maintaining external current flow, eliminating internal current constriction points and their associated harmful effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation performance, reduces reliability risks, and optimizes space and current carrying capacity by routing current and heat outside the housing, maintaining reliability and service life.
Implementation Method 1
a current path between the at least two semiconductor components is formed by means of a metallic connecting clip which connects a first electrode of a first semiconductor component to a second electrode of a second semiconductor component
Implementation Method 2
a second clip side of the connecting clip forms an exposed contact point... a contact element outside the housing forms an additional high-current path and heat path
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
The invention relates to a semiconductor module (1) with at least two semiconductor components (10, 20), each of which has an active semiconductor layer (12, 22) arranged on a carrier (2) inside a housing (3), with a current path between the at least two Semiconductor components (10, 20) is formed by means of a metallic connecting clip (30) which connects a first electrode (14) of a first semiconductor component (10) to a second electrode (26) of a second semiconductor component (20). The first semiconductor component (10) and the second semiconductor (20) are arranged on the carrier (2) rotated by 180° with respect to one another, so that the first electrode (14) of the first semiconductor (10) and the second electrode (26) of the second semiconductor (20) are arranged in a common plane and are each electrically connected to a first clip side (32) of the metallic connecting clip (30), a second clip side (34) of the connecting clip (30) forming an exposed contact point (4.1) which flush with a first surface (4) of the housing (3).