Power Semiconductor Module Clip Terminal Design
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Solution Overview
Problem
Power semiconductor modules face challenges with high heat resistance and increased material and process costs due to soldering and wire bonding, especially when operating at high voltages and temperatures, requiring more efficient heat management and reduced material usage.
Innovation Solution
A power semiconductor module directly connects internal devices using clip-shaped terminals, eliminating the need for soldering and wire bonding, and incorporates an insulating member and sealing material to enhance contact strength and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering and wire bonding are used to connect metal tab to semiconductor die, then electrical connection is achieved, but material costs and process costs increase
Solution Approach 1:
The patent extracts and eliminates the soldering and wire bonding processes from the manufacturing workflow. Instead of using traditional bonding methods, the invention uses a direct mechanical connection system where the metal tab is pressed against the semiconductor die with spring force, removing the need for expensive solder materials and complex bonding equipment.
Solution Approach 2:
The metal tab structure incorporates built-in spring elements that automatically provide contact force and maintain electrical connection without requiring external bonding processes. The elastic deformation of the metal tab itself provides the necessary bonding force, making the system self-sufficient and eliminating dependency on additional materials and processes.
2Reliability
If traditional bonding methods are used, then electrical connection is established, but heat resistance increases
Solution Approach 1:
The patent removes the thermal barrier introduced by solder joints and wire bonds. By eliminating these intermediate bonding layers, the invention creates a direct thermal path from the semiconductor die to the heat sink, significantly improving heat dissipation capability while maintaining electrical connection.
Solution Approach 2:
The invention merges the electrical connection function and thermal conduction function into a single integrated metal tab structure. The same metal tab that provides electrical connectivity also serves as a heat conduction path, eliminating the need for separate thermal management components and reducing thermal resistance.
3Strength
If multiple bonding processes are used, then secure connection is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates multiple bonding processes (soldering, wire bonding, adhesive bonding) from the manufacturing sequence. The invention replaces these complex multi-step processes with a single mechanical pressing operation that achieves both electrical connection and mechanical bonding simultaneously.
Solution Approach 2:
The metal tab structure is designed to perform multiple functions simultaneously: providing electrical connection, mechanical bonding, thermal conduction, and maintaining contact force. This multi-functionality is achieved through the integrated spring-loaded design that combines all these capabilities in a single component and single installation step.
Data Source
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AI summary
A power semiconductor module may include a first device and a second device spaced apart from the first device at a predetermined interval. A first assembling terminal is fixedly disposed between the first device and the second device to be a first connection terminal. A second assembling terminal is fixedly assembled to contact outer surfaces of the first device and the second device to be a second connection terminal.