Selective Coating Layer for Semiconductor Module Adhesion
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Solution Overview
Problem
Existing semiconductor modules face challenges in achieving effective adhesion between sealing resins and metal portions, leading to potential peeling issues and reduced reliability.
Innovation Solution
A semiconductor module design that includes a coating layer, preferably made of polyimide or polyamide, applied selectively on critical surfaces such as the semiconductor chip, stacked substrate, and PCB, enhancing adhesion with the sealing resin and improving impact resistance and thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyimide resin is applied to the whole surface of a semiconductor module to increase adhesion between sealing resin and metal portion, then adhesion is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies the coating layer selectively to specific metal portions (such as the semiconductor cooler and/or circuit board) rather than the entire module surface. This localized application provides adhesion enhancement exactly where the sealing resin contacts metal, while reducing material consumption and manufacturing cost compared to full-surface coating.
2Ease of manufacture
If a coating layer is selectively applied to reduce cost, then manufacturing cost decreases, but adhesion between sealing resin and metal portion may be insufficient
Solution Approach 1:
The patent identifies and coats only the specific metal portions that come into contact with the sealing resin (semiconductor cooler, circuit board, or both). This targeted approach ensures adequate adhesion at the critical interface while minimizing coating material usage and associated costs.
Solution Approach 2:
The patent divides the module into distinct components (semiconductor cooler, circuit board, housing) and applies the coating layer selectively to the metal portions that require adhesion enhancement, rather than treating the entire module uniformly.
3Strength
If the coating layer is applied on critical surfaces, then impact resistance and thermal stability improve, but device complexity increases
Solution Approach 1:
The patent applies the coating layer only to specific metal portions (semiconductor cooler and/or circuit board) rather than all components. This selective application provides enhanced impact resistance and thermal stability where needed at the sealing interface, while avoiding unnecessary complexity in areas where such protection is not required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The selective application of the coating layer improves the adhesion between the sealing resin and the semiconductor module components, enhancing the reliability and longevity of the module by preventing peeling and improving thermal and impact resistance.
Implementation Method 1
a coating layer, which is provided between a sealing resin of an element and a metal portion of a semiconductor module
Data Source
AI summary
There is provided a semiconductor module including: a base for semiconductor cooling; a stacked substrate provided above the base; a semiconductor chip provided above the stacked substrate; a coating layer provided on an upper surface of the semiconductor chip; and a sealing resin for sealing the semiconductor chip, in which the base is in contact with the sealing resin.