Power Semiconductor Module Coating Layout for Corrosion-Resistant Terminals
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Solution Overview
Problem
Existing power semiconductor modules face challenges in maintaining an efficient manufacturing process with sufficient process stability while ensuring oxidation and corrosion resistance of circuit metallizations, particularly in vertically arranged terminals.
Innovation Solution
A power semiconductor module design featuring a substrate with circuit metallizations partially coated with a metal coating, where openings in a resin body expose the metal coating to prevent oxidation and corrosion, and facilitate improved adhesion and joining processes, combined with a method that applies the metal coating only where necessary to enhance manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit metallization is fully coated with metal coating to prevent oxidation and corrosion, then the reliability is improved, but the adhesion strength between resin body and circuit metallization is reduced
Solution Approach 1:
The patent applies metal coating only to specific portions of the circuit metallization that are exposed through openings in the resin body, rather than coating the entire surface. This localized coating approach prevents oxidation and corrosion at critical exposed areas while leaving other areas uncoated to maintain strong adhesion between the resin body and circuit metallization.
2Ease of operation
If openings are provided in the resin body for terminal mounting, then the ease of operation is improved, but the circuit metallization is exposed to oxidation and corrosion
Solution Approach 1:
The patent provides openings in the resin body for terminal mounting while applying metal coating to the exposed portions of the circuit metallization within these openings. This creates a differentiated structure where the exposed areas receive protective coating while the covered areas maintain structural integrity and adhesion.
3Reliability
If the metal coating is applied to the entire circuit metallization, then the protection against oxidation and corrosion is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent reduces manufacturing complexity by applying metal coating only to specific exposed portions of the circuit metallization rather than the entire surface. This selective coating approach decreases material consumption, simplifies the coating process, and reduces costs while maintaining adequate protection where it is most needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances adhesion strength, reduces mechanical damage, decreases humidity penetration, and increases reliability by preventing oxidation and corrosion, while simplifying the manufacturing process and reducing costs.
Implementation Method 1
The metal coating of the substrate surface will prevent oxidation and/or corrosion of exposed portions of the first circuit metallization
Implementation Method 2
the metal coating improves the joining processes, e.g. by an improved adhesion of the joining material
Data Source
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AI summary
A power semiconductor module (100) is provided, comprising a substrate (10), having a first main surface (11) and a second main surface (12) opposite the first main surface (11) along a stacking direction (S1). The power semiconductor module (100) further comprises a first circuit metallization (20) with a first portion (21) and a second portion (22), arranged on the first main surface (11). The power semiconductor module (100) further comprises a metal coating (30) arranged in the first portion (21) of the first circuit metallization (20) and a resin body (40) covering the substrate (10) and the second portion (22) of the first circuit metallization (20). The resin body (40) has a top surface (41) extending along a first extension area (A1), and an inner surface (42) facing the first circuit metallization (20). The resin body (40) comprises at least one opening (45) extending into the resin body (40) from the top surface (41) to the inner surface (42) along the stacking direction (S1) and terminates at the metal coating (30), such that the metal coating (30) is exposed.