Semiconductor Module Coil Fixation via Sandwiched Current Paths
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Solution Overview
Problem
Existing semiconductor modules face challenges in efficiently fixing a coil around the main current path, leading to difficulties in enhancing switching speed without increasing current supply capacity, and in minimizing device dimensions while maintaining effective magnetic field generation.
Innovation Solution
A semiconductor module design where the coil unit is sandwiched between two main current passages with opposing energization directions or angles, generating enhanced magnetic fields that interlink with the coil to produce an induced electromotive force, allowing for easy fixation and high-speed switching operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a ferrite core with ring shape and coil wound around it is used as in JP-A-2008-235997, then induced electromotive force can be generated to enhance switching speed, but it becomes difficult to fix the coil due to spacing from the lead
Solution Approach 1:
The patent transitions from a three-dimensional ring-shaped core structure to a planar substrate-integrated coil structure. The coil is formed on the same substrate as the main current passages, eliminating the need for separate spatial arrangement and fixing mechanisms. This dimensional integration resolves the fixation difficulty while maintaining the electromagnetic induction function for high-speed switching.
2Speed
If current supply capacity of the driving circuit is increased to shorten charging time of parasitic capacitance, then switching speed is improved, but device complexity and current supply requirements increase
Solution Approach 1:
The patent employs the main current passages themselves to generate the induced electromotive force through electromagnetic induction. The system uses its own operating current to provide the switching enhancement, eliminating the need for separate high-capacity current supply circuits. This self-service approach achieves high-speed switching without increasing overall device complexity or current supply requirements.
3Power
If coil is arranged around main current path with spacing from lead, then induced electromotive force can be generated, but device dimensions increase and fixation becomes difficult
Solution Approach 1:
The patent merges the coil structure with the main current passages by forming both on the same substrate. This integration eliminates the need for separate spatial arrangement and reduces the overall device volume. The coil and current passages work together in a compact, unified structure that maintains electromagnetic induction efficiency while minimizing device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient generation of induced electromotive voltage, enhancing switching speed and reducing parasitic inductance, while minimizing device dimensions and simplifying coil fixation, thus overcoming the limitations of prior art.
Implementation Method 1
a coil unit sandwiched between the first and second main current passages. The coil unit includes a coil, which generates an induced electromotive force when a magnetic flux interlinks with the coil
Data Source
AI summary
A semiconductor module includes: a semiconductor element; first and second main current passages for energizing the semiconductor element, the first and second main current passages being opposed to each other in such a manner that a first energization direction of the first main current passage is opposite to a second energization direction of the second main current passage, or an angle between the first energization direction and the second energization direction is an obtuse angle; and a coil unit sandwiched between the first and second main current passages. The coil unit includes a coil, which generates an induced electromotive force when a magnetic flux interlinks with the coil, the magnetic flux being generated when current flows through the first and second main current passages.