Semiconductor Module Conductive Member Heat Radiation Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices attached to heat sinks using screws often experience insufficient pressure at the center, leading to inadequate heat radiation and potential size constraints due to the need for multiple screws.
Innovation Solution
A semiconductor device design featuring a semiconductor module with heat generation elements and conductive members, where at least one conductive member is shaped to protrude into the heat radiation region, allowing efficient heat transfer and radiation from elements outside the primary contact area, enabling more compact layouts and reduced component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple screws are used to fix the semiconductor device to the heat sink, then the heat radiation is improved, but the device size and complexity increase
Solution Approach 1:
The heat radiation function is segmented between two types of components: pressing members that provide mechanical fixation and localized pressure, and conductive members that provide thermal conduction pathways. This segmentation allows heat from multiple sources to be conducted to the heat sink without requiring multiple pressing members, thus improving heat radiation while reducing device complexity
Solution Approach 2:
Conductive members act as intermediaries between heat generation elements and the heat sink. These conductive members extend into the heat radiation possible region and provide thermal pathways for heat elements located outside the direct pressing area, enabling efficient heat transfer without requiring additional pressing members at each heat source location
2Device complexity
If screws are placed at the ends of the semiconductor device, then the structure is simplified, but the forcing pressure at the center is insufficient
Solution Approach 1:
Conductive members serve as intermediaries that bridge the gap between the limited pressing points and the distributed heat generation elements. By extending these conductive members into the heat radiation possible region, thermal contact is established without requiring additional mechanical pressing members, thus maintaining structural simplicity while improving pressure distribution effectiveness
Solution Approach 2:
The conductive members are strategically positioned to provide localized thermal conduction pathways in the heat radiation possible region. This local quality enhancement allows efficient heat transfer from specific areas without requiring uniform mechanical pressure distribution across the entire device, resolving the contradiction between simple structure and adequate pressure
3Temperature
If all heat generation elements are placed within the heat radiation possible region, then heat radiation is maximized, but the layout flexibility is reduced
Solution Approach 1:
Conductive members function as intermediaries that extend the heat radiation capability beyond the physically limited heat radiation possible region. By providing thermal pathways through these conductive members, heat elements can be positioned outside the direct pressing area while still achieving effective heat transfer, thus maintaining layout flexibility without sacrificing heat radiation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat radiation efficiency, allows for more heat generation elements per pressing member, and reduces the number of pressing members required, resulting in improved thermal performance and module downsizing while maintaining flexibility in layout.
Implementation Method 1
The heat generated by the heat generation element disposed outside the heat radiation possible region is transferred via the conductive member and is radiated from the heat radiation possible region to the heat radiation member
Data Source
AI summary
A semiconductor device includes a semiconductor module and a pressing member pressing the semiconductor module to a heat radiation member. The semiconductor module includes heat generation elements generating heat by energization, three or more conductive members each of which mounted with at least one of the heat generation elements, and a molding part integrally molding the heat generation elements and the conductive members. The semiconductor module has a heat radiation possible region in which a forcing pressure by the pressing member is equal to or greater than a predetermined pressure. The conductive member mounted with the heat generation element disposed outside the heat radiation possible region has such a shape that at least a part of the conductive member is included in the heat radiation possible region.