Power Semiconductor Module Conductive Post Inductance Reduction
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Solution Overview
Problem
Conventional power semiconductor modules have limitations in achieving low inductance, particularly for high-frequency switching applications, and face challenges with current density, assembly complexity, and reliability due to bonding wiring constraints.
Innovation Solution
The power semiconductor module incorporates a circuit board and conductive posts to electrically connect semiconductor elements and multilayer substrates, replacing bonding wiring to reduce inductance and enhance reliability, allowing for higher current density and easier assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wiring is used to electrically connect semiconductor chips to multilayer substrate, then electrical connection is achieved, but inductance is high and current density is limited
Solution Approach 1:
The invention extracts and removes the bonding wiring from the electrical connection path between semiconductor chips and multilayer substrate. By eliminating this component entirely and replacing it with direct electrical connection through conductive posts, the source of high inductance is removed, achieving low inductance while maintaining reliable electrical connection.
Solution Approach 2:
The invention replaces the mechanical bonding wiring system with a direct conductive post system. Instead of using flexible wiring that requires mechanical attachment, the patent uses rigid conductive posts that provide both mechanical support and electrical connection, thereby eliminating the inductance associated with wiring while maintaining connection reliability.
2Ease of manufacture
If bonding wiring is used for electrical connection, then assembly is possible, but assembly complexity increases and manufacturing difficulty arises
Solution Approach 1:
The invention merges the electrical connection function and mechanical support function into a single conductive post structure. By combining these functions, the need for separate bonding wiring and its associated attachment processes is eliminated, simplifying the assembly process and reducing manufacturing complexity while maintaining ease of assembly.
Solution Approach 2:
The conductive posts serve multiple functions simultaneously: providing electrical connection, mechanical support, and structural alignment. This multi-functionality reduces the number of components and assembly steps required, thereby simplifying manufacturing and reducing assembly complexity compared to dedicated bonding wiring systems.
3Strength
If conventional module structure is used, then semiconductor chips are supported, but inductance cannot be reduced further for high-frequency switching
Solution Approach 1:
The invention transitions from a planar wiring-based connection approach to a three-dimensional conductive post structure. By utilizing the vertical dimension and implementing direct through-substrate conductive posts, the electrical connection path is shortened and optimized, achieving low inductance suitable for high-frequency switching while maintaining structural support capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves lower inductance, improved reliability, and simplified manufacturing, while accommodating higher current densities and smaller semiconductor chips, addressing the limitations of conventional modules.
Implementation Method 1
a conductive post electrically connected and fixed to the second electrode of the semiconductor element at one end and electrically connected and fixed to the metal film of the circuit board at another end
Implementation Method 2
a metal base; a semiconductor element having a first electrode and a second electrode on principal surfaces thereof, the first electrode being electrically connected and fixed to the metal base
Data Source
AI summary
A power semiconductor module is equipped with: a metal base; semiconductor chips electrically connected with and fixed to the metal base; and an insulating substrate fixed to the metal base and having a circuit plate on one surface. Additionally, the power semiconductor module is further equipped with a circuit board that is provided so as to face the semiconductor chips and the insulating substrate and that electrically connects electrodes of the semiconductor chips and the circuit plate of the insulating substrate. Further, the power semiconductor module is equipped with a conductive post that is electrically connected to at least one of either the electrodes of the semiconductor chips or the circuit plate of the insulating substrate while being electrically connected to the metal film of the circuit board.