Power Semiconductor Module Connection Element Positioning

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Solution Overview

Problem

The existing methods for manufacturing power semiconductor modules with plastic housings and connection elements are prone to errors and are costly due to the need for precise positioning during the manufacturing process.

Innovation Solution

A method involving forming a housing with pre-fixed connection elements, arranging switchgear and connecting them to the substrate, using a positioning device to fix their position, and then securing them using either an adhesive compound or deformation of the housing, allowing for flexible and precise placement of connection elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If connection elements are pre-fixed in the housing during manufacturing, then the housing can be produced efficiently, but the positioning precision of connection elements deteriorates

Engineering Contradiction:

Improvehousing manufacturing efficiencyVSAvoidconnection element positioning precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The connection element consists of multiple segments: a foot portion that is pre-fixed in the housing, and a contact portion that can be adjusted. This segmentation allows the housing to be manufactured efficiently with pre-positioned elements, while the adjustable contact portion enables subsequent precision positioning during assembly.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The contact portion of the connection element is designed to be movable relative to the foot portion, transitioning from a fixed state during housing manufacturing to an adjustable state during final assembly. This dynamic capability allows the system to achieve both high productivity in housing production and high precision in final positioning.

Inventive Principle:

Principle #15Dynamics

2Manufacturing precision

If connection elements are pre-positioned with final quality requirements during housing manufacture, then positioning accuracy is improved, but manufacturing costs increase

Engineering Contradiction:

Improveconnection element positioning accuracyVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The foot portion of the connection element is pre-fixed in the housing during manufacturing, establishing a rough position that facilitates subsequent assembly. The final precision positioning is then achieved through adjustable contact portions during final assembly, avoiding the need for expensive high-precision fixation during housing manufacturing.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If connection elements are made movable for flexible positioning, then adaptability is improved, but positioning stability deteriorates

Engineering Contradiction:

Improvepositioning flexibilityVSAvoidconnection element position stability

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The connection element transitions from a movable state during positioning to a fixed state during operation. The adjustable contact portion enables flexible positioning during assembly, while the final fixed configuration ensures stability during module operation, achieving both adaptability and stability at different stages.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces errors and costs by enabling flexible positioning and secure fixation of connection elements within the housing, ensuring accurate placement and reliable operation of power semiconductor modules.

Implementation Method 1

the connection elements are fixed in position by means of an adhesive compound, with which openings in the housing or in the positioning device are preferably filled

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

Alternatively to this, it may be preferred if the connection elements are fixed in position by deformation of a deformation portion of the housing or of the positioning device

Methodology Applied

Scientific EffectDeformation: Deformation

Implementation Method 3

the housing is formed as a plastic housing and the connection elements are pre-fixed therein using an injection moulding technique

Methodology Applied

Scientific EffectInjection moulding:

Data Source

PatentUS20230197468A1Method for manufacturing a power semiconductor module and power semiconductor module

Publication Date: 2023.06.22 SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG

AI summary

A method for manufacturing a power semiconductor module and a power semiconductor module having, in each case, a housing, a switchgear arranged in this housing and having a plurality of connection elements, has the following method steps: A) forming a housing with pre-fixed connection elements; B) arranging the switchgear in the housing and connecting the connection elements to connection surfaces of a substrate of the switchgear; C) arranging a positioning device for fixing the position of the connection elements with respect to one another; D) fixing the connection elements relative to one another and to the housing.