Semiconductor Module Contact Layout for Low-Inductance Switching
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Solution Overview
Problem
Existing semiconductor modules face challenges in achieving high switching frequencies and power densities while accommodating various circuit topologies in a flexible, standardized package, with constraints on semiconductor element distribution and contacting posing significant limitations.
Innovation Solution
The semiconductor module design includes contact electrodes that are bent and positioned flexibly on a substrate within a housing, using a common punching tool to manufacture these electrodes, allowing for standardized housing and reduced lead inductances, enabling high switching frequencies and power densities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor elements are connected in parallel to increase performance, then power density increases, but module size and layout complexity increase
Solution Approach 1:
The module is divided into multiple identical sub-modules, each containing a subset of semiconductor elements. This segmentation allows parallel connection of elements while maintaining a regular, repetitive layout pattern that reduces overall complexity despite the increased number of components.
Solution Approach 2:
Multiple identical contact electrodes are designed with the same structure and configuration, allowing them to serve the same function across different locations. This universality simplifies the design process and reduces layout complexity by using a standardized template that can be replicated throughout the module.
2Speed
If switching frequency is increased, then performance improves, but lead inductance must be reduced
Solution Approach 1:
The contact electrodes are designed with a three-dimensional bent structure that connects to the substrate at multiple points (four contact surfaces arranged rectangularly). This spatial configuration reduces the effective current loop area and lead inductance by distributing the connection in three dimensions rather than using simple planar connections.
Solution Approach 2:
The contact electrodes feature bent sections with curved geometries that optimize the current path. The bending of the electrodes creates optimized current loops with reduced area, thereby reducing lead inductance while maintaining mechanical flexibility and electrical connection.
3Ease of manufacture
If standardized housing is used, then manufacturing ease improves, but flexibility in semiconductor element distribution is limited
Solution Approach 1:
The contact electrodes are designed as bent metal parts that can be produced using a common punching tool, allowing for flexible positioning and configuration. This dynamic design approach enables the same standardized housing to accommodate different semiconductor element distributions by simply repositioning or reconfiguring the bendable contact electrodes.
Solution Approach 2:
The contact electrodes can be manufactured with varying bend radii, angles, and contact surface positions while using the same basic punching tool. By changing the geometric parameters of the bent sections, the same standardized housing can support different element distributions and circuit topologies without requiring custom housing designs.
Data Source
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AI summary
The invention relates to a semiconductor module (2) comprising a semiconductor circuit (34) and a housing (4) which comprises a heat sink (6), wherein the housing (4) at least partially surrounds the semiconductor circuit (34), wherein the semiconductor circuit (34) has at least one substrate (36, 38) which is arranged on a flat surface (7) of the heat sink (6), semiconductor elements (46) which are contacted on the at least one substrate (36, 38).In order to provide a semiconductor module (2) that is as flexible as possible and enables high switching frequencies and power densities, it is proposed that contact electrodes (12, 16, 20, 14, 18, 22) are connected to the semiconductor circuit (34) and are each led outwards through a housing recess (24) in a cover surface (10) of the housing (4), wherein the contact electrodes (12, 16, 20, 14, 18, 22) each have a contacting section (26) that is led at least partially outwards, a central section (50) and a connecting section (52) that can be connected to the substrate (36, 38), wherein the connecting section (52) of the respective contact electrode (12, 16, 20, 14, 18, 22) is formed by translatory bending of the contacting section (26) and connecting section (52) to the respective central section (50) with a fixed positioning to Housing recess (24) can be connected to four, in particular rectangularly arranged, contact surfaces (54) on the substrate (36, 38).