Disk-Shaped Semiconductor Module Cooling via Intermediary Contact Plate
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Solution Overview
Problem
Existing transformer arrangements, particularly in resistance welding systems, face challenges in cooling electrical components due to indirect and inefficient heat dissipation methods, which limit power output and require costly and complex designs to manage heat and corrosion.
Innovation Solution
A semiconductor module with a disk-shaped semiconductor component between two contact plates, where the contact plates are cooled by a fluid on their side facing away from the semiconductor, allowing for effective heat dissipation without direct fluid contact, using materials with high thermal conductivity like copper or aluminum, and a threaded fastening system for robust and economical assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor component is in direct contact with the cooling fluid, then cooling efficiency is improved, but corrosion occurs and additional sealing is required
Solution Approach 1:
The patent introduces a contact plate as an intermediary component between the semiconductor component and the cooling fluid. The contact plate has a cooling fluid duct that allows the cooling fluid to flow, while the semiconductor component is mounted on the outer surface of the contact plate. This intermediary structure enables heat dissipation without direct contact between the cooling fluid and semiconductor component, thus avoiding corrosion while maintaining effective cooling.
2Temperature
If the semiconductor component is in direct contact with the cooling fluid, then cooling efficiency is improved, but sealing complexity increases
Solution Approach 1:
The contact plate serves as a mediator that integrates the cooling fluid duct structure. The semiconductor component is mounted on the outer surface of the contact plate, and the cooling fluid flows through the duct in the contact plate. This design eliminates the need for complex sealing arrangements between the semiconductor component and cooling fluid path, simplifying the overall sealing structure while maintaining effective cooling.
3Strength
If welding is used to connect copper pipes to carrier components, then mechanical strength is improved, but material properties deteriorate due to heat addition
Solution Approach 1:
The patent replaces the welding process with a mechanical fastening system. The contact plate is connected to the carrier component using fastening elements such as screws or clips, eliminating the need for welding. This mechanical connection method avoids adding heat to the copper pipe material, preserving its mechanical properties and eliminating the need for post-welding cleaning processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling efficiency, reduces corrosion risk, simplifies sealing, and allows for a more compact, robust, and cost-effective transformer arrangement with improved heat dissipation and reduced material alteration, eliminating the need for expensive connectors and complex assembly processes.
Implementation Method 1
a preferred contact plate material such as copper or aluminum has a higher thermal conductivity than does the semiconductor material which is typically silicon
Implementation Method 2
act on at least one contact plate using a cooling fluid on its side facing away from the semiconductor component
Data Source
AI summary
A semiconductor module (500) for connecting to a transformer winding (132, 133; 408; 409) includes a semiconductor component (501) that is disk-shaped and disposed between two contact plates (502). One of the contact plates (502) is acted upon using a cooling fluid on its side facing away from the semiconductor component (501).