Power Semiconductor Module Contact Arrangement Torque Absorption
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Modern power semiconductor modules face mechanical stress due to high torque and bending moments, particularly at the load connection elements, which can lead to damage from external conductor connections and temperature-induced deformations.
Innovation Solution
Incorporating a flat, shaped metal body between the external conductor connection device and the load connection element, which restricts rotation to a few degrees and absorbs torque, thereby reducing stress on internal connections and diverting bending moments to the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a direct mechanical connection is made between external conductor and load connection element, then electrical connection is achieved, but high torque and bending moments damage internal connections
Solution Approach 1:
A contact device with a flat shaped metal body is introduced as an intermediary component between the external conductor and the load connection element. This mediator absorbs torque through its resilient arm structure and redirects bending moments to the housing, protecting the internal wire bond connections from mechanical damage while maintaining electrical connectivity.
2Ease of operation
If the contact device allows full rotation, then ease of connection is improved, but mechanical stability and connection precision deteriorate
Solution Approach 1:
The contact device incorporates a rotation-limiting structure that preemptively prevents excessive rotation before it can cause misalignment or damage. The flat shaped metal body and housing structure work together to restrict rotation to a controlled range, maintaining mechanical stability while still allowing sufficient movement for easy connection.
3Reliability
If the resilient arm structure is added to absorb torque, then internal connection protection is improved, but device complexity increases
Solution Approach 1:
The flat shaped metal body serves multiple functions simultaneously: it provides electrical conductivity, absorbs torque through elastic deformation, limits rotation through geometric constraints, and transfers bending moments to the housing. This multi-functionality reduces the need for separate components, thereby minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces mechanical loads on internal connections, enhancing the durability and reliability of power semiconductor modules by distributing torque and bending moments effectively.
Implementation Method 1
the shaped metal body absorbs a significant proportion of the torque when the external conductor is attached
Implementation Method 2
a resilient arm bent laterally to the base area of the shaped metal body
Data Source
Figure 1
Figure 2
AI summary
The invention describes a power semiconductor module comprising a substrate, power semiconductor components arranged thereon, a housing, and externally leading load connection elements. The load connection elements (4) are each designed as a metal form with at least one contact element (40) with a contact surface (42) for external electrical connection to a connection element (82) of a power supply (8), and wherein a metal form (70) is arranged between the connection element (82) of the external conductor (8) and the contact element (40) of the load connection element (4), and wherein rotation of the metal form (70) about its vertical axis is either not possible or only possible by a few degrees, at most 10 degrees.