Semiconductor Module Layout With Separated Control Wiring
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Solution Overview
Problem
The existing semiconductor modules are bulkier and more costly due to the combination of main wiring and signal wiring on the same substrate, which hinders miniaturization and increases costs, as the substrate requires heat dissipation measures for main wiring but not for signal wiring.
Innovation Solution
A semiconductor module design featuring a multilayer substrate with a main wiring layer and separate control boards for control wiring, where the control boards are mounted on metal plates with insulating plates, allowing for a more compact and cost-effective configuration by separating the control wiring from the main wiring layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If main wiring and signal wiring are provided on the same substrate, then electrical connection is simplified, but the substrate becomes bulkier and more costly due to heat dissipation requirements
Solution Approach 1:
The patent divides the wiring system into two separate substrates: a first substrate for main wiring and a second substrate for signal wiring. This segmentation allows each substrate to be optimized independently, with the first substrate designed for heat dissipation and the second substrate designed for signal routing, thereby reducing the overall size while maintaining functionality
Solution Approach 2:
The patent transitions from a planar two-dimensional wiring layout to a three-dimensional stacked configuration where the first and second substrates are positioned at different vertical levels. The first substrate is located below the semiconductor element and the second substrate is positioned above, connected through conductive structures that penetrate through the semiconductor element, enabling spatial separation of wiring functions
2Device complexity
If main wiring and signal wiring are provided on the same substrate, then electrical connection is simplified, but manufacturing cost increases due to heat dissipation measures
Solution Approach 1:
By segmenting the wiring into separate substrates, each substrate can be manufactured with appropriate materials and structures for its specific function. The first substrate can use cost-effective heat dissipation materials while the second substrate focuses on signal integrity, avoiding the need for an expensive substrate that must simultaneously handle both high-power heat dissipation and precision signal routing
Solution Approach 2:
Each substrate is designed with localized properties appropriate to its function: the first substrate has heat dissipation characteristics optimized for main power wiring, while the second substrate has signal routing characteristics optimized for control signals. This local optimization reduces overall manufacturing cost compared to a single substrate requiring universal properties
3Temperature
If control wiring is separated from main wiring layer, then heat dissipation efficiency is improved, but device structure becomes more complex
Solution Approach 1:
The patent segments the thermal management system by placing the main wiring on a first substrate that is directly coupled to the semiconductor element's power terminals, creating an efficient thermal path. The signal wiring is separated onto a second substrate, allowing the first substrate to be optimized purely for heat dissipation without the complexity of integrating signal routing
Data Source
AI summary
A semiconductor module includes a multilayer substrate having a main wiring layer formed therein, a main current flowing in the main wiring layer when the semiconductor device is turned on, a first and second semiconductor elements, each of which has a top electrode on a top surface thereof and a bottom electrode on a bottom surface thereof, and is disposed on a top surface of the main wiring layer to which the bottom electrode is conductively connected, a metal plate having an end portion, a bottom surface of the end portion being conductively connected to the top electrode of the first semiconductor element, and a control board including an insulating plate disposed on the top surface of the end portion and a control wiring layer disposed on a top surface of the insulating plate for controlling turning on and off of the first and second semiconductor elements.