Power Semiconductor Module Alignment for Leak-Free Cooler Assembly
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Solution Overview
Problem
Existing power semiconductor modules face challenges in achieving precise alignment and positioning with coolers, leading to potential leakage of cooling medium and reduced cooling efficiency, which affects the reliability and lifetime of the modules.
Innovation Solution
The power semiconductor module incorporates protruding parts with alignment holes and a cooler with corresponding alignment holes, allowing for precise alignment and positioning through the use of alignment pins and fixtures, ensuring correct assembly and improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If power semiconductor modules are mounted on a cooler without alignment holes, then the assembly process is simpler, but the positioning precision and alignment accuracy deteriorate, leading to cooling medium leakage and reduced cooling efficiency
Solution Approach 1:
The power semiconductor module is segmented into distinct functional components: a base plate with cooling structure, semiconductor chips mounted on the base plate, and alignment holes provided in the base plate. This segmentation allows the alignment function to be separated from the cooling function, enabling precise positioning while maintaining structural clarity and manufacturability.
Solution Approach 2:
Alignment holes are introduced as intermediary elements between the power semiconductor module and the cooler. These holes serve as mediators that facilitate precise alignment and positioning during assembly, ensuring proper mechanical connection and preventing cooling medium leakage without complicating the overall device structure.
2Manufacturing precision
If alignment holes are provided in the power semiconductor module, then the alignment accuracy and positioning precision improve, but the device complexity and manufacturing cost increase
Solution Approach 1:
The alignment holes are merged with the base plate structure, combining the alignment function with the existing mechanical support component. This integration allows alignment holes to be formed during the base plate manufacturing process itself, eliminating the need for separate alignment components and reducing overall manufacturing cost despite improved alignment accuracy.
Solution Approach 2:
The base plate serves multiple functions: it provides mechanical support for the semiconductor chips, acts as a thermal management component with integrated cooling structures, and incorporates alignment holes for precise positioning. This multi-functionality reduces the need for additional components, thereby controlling manufacturing costs while achieving high alignment accuracy.
3Temperature
If the cooling structure has increased surface area with pin fins, then the cooling efficiency improves, but the device complexity increases
Solution Approach 1:
The cooling structure employs pin fins with extended surface area that may incorporate curved or optimized geometries to enhance heat dissipation efficiency. The curved surfaces of pin fins increase the effective cooling area while maintaining a compact form factor, improving temperature management without proportionally increasing structural complexity.
Solution Approach 2:
The cooling structure extends into the vertical dimension with pin fins protruding from the base plate surface. This three-dimensional configuration increases the cooling surface area available for heat dissipation while maintaining a compact footprint, thereby improving cooling efficiency without significantly increasing the device's lateral complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable and efficient cooling by preventing cooling medium leakage and enhancing the lifetime and reliability of the semiconductor modules, while reducing manufacturing costs and time.
Implementation Method 1
the cooling structure comprises a plurality of pin fins. Each pin fin is exemplarily formed from a pillar, wherein a tip of each pin fin extends in vertical direction facing away from the first main side
Implementation Method 2
the pin fins increase an area of a bottom surface of the base plate at the first main side
Data Source
Figure 1~2
Figure 3~5
Figure 6~7
AI summary
A power semiconductor module (1) is specified, comprising: - at least one semiconductor chip (5) being connected to a cooling structure (3), - at least two power terminals (7) being in electrical contact to the at least one semiconductor chip (5), and - a housing (23) for the power semiconductor chip (5) and the at least two power terminals (7), wherein - each of the at least two power terminals (7) has a protruding part (9) protruding beyond the housing (23) in lateral directions, and - each of the at least two protruding parts (9) is provided with a first alignment hole (10). Further, a power semiconductor device and a method for producing a power semiconductor device is specified.