Semiconductor Module Cooler Layout for Compact Vehicle Power Conversion
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Solution Overview
Problem
The existing semiconductor modules with coolers have a relatively large size, necessitating a reduction in overall size while maintaining effective cooling capabilities.
Innovation Solution
A semiconductor module design featuring a compact cooler configuration with a housing and heat dissipation bodies, utilizing a refrigerant flow through a hollow portion to efficiently cool semiconductor devices, and incorporating a power conversion circuit with optimized placement of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional cooler structure with housing and heat dissipation body is used, then effective cooling capability is achieved, but the overall module size becomes relatively large
Solution Approach 1:
The patent places the heat dissipation body inside the hollow portion of the housing, creating a nested structure where one component is housed within another. This nesting arrangement reduces the overall module volume while maintaining the cooling function, as the heat dissipation body is positioned within the existing housing space rather than adding external volume.
Solution Approach 2:
The patent transitions from a conventional external heat dissipation body arrangement to an internal placement within the hollow portion. This spatial reconfiguration utilizes the third dimension (depth/internal space) more effectively, allowing the cooling system to maintain its functionality while reducing the external footprint of the module.
2Volume of moving object
If the heat dissipation body is placed inside the hollow portion of the housing, then the module size is reduced, but the heat dissipation efficiency may be compromised
Solution Approach 1:
The patent applies different functional qualities to different parts of the housing. The hollow portion is specifically designed to accommodate the heat dissipation body, creating a localized thermal management zone. This local optimization ensures that the internal placement does not compromise heat dissipation efficiency, as the housing structure is tailored to support the thermal function in that specific region.
Solution Approach 2:
The housing acts as an intermediary structure that facilitates heat transfer from the semiconductor device to the refrigerant. By positioning the heat dissipation body within the hollow portion and using the housing as a thermal conduit, the system maintains effective heat dissipation despite the compact internal arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a reduction in module size while maintaining efficient heat dissipation and power conversion capabilities, enhancing the integration and performance of semiconductor modules in vehicles.
Implementation Method 1
When a refrigerant flows down the hollow area, the refrigerant contacts the heat dissipation body. This allows the semiconductor device to be cooled through the heat dissipation body.
Implementation Method 2
When a refrigerant flows down the hollow area, the refrigerant contacts the heat dissipation body.
Data Source
AI summary
A semiconductor module includes a cooler, a plurality of semiconductor devices, and a capacitor. The cooler includes a housing having a receiving portion and a hollow portion that is disposed externally around the receiving portion as viewed in a first direction. The housing has a first surface, a second surface, and a third surface on which the plurality of semiconductor devices are respectively mounted. Each of the first surface, the second surface, and the third surface faces away from the receiving portion with respect to the hollow portion in a direction orthogonal to the first direction. The first surface, the second surface and the third surface each have a different normal direction. At least a part of the capacitor is housed in the receiving portion.