Semiconductor Module Cooling Device With Asymmetric Side Wall
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Solution Overview
Problem
Conventional semiconductor modules face challenges in efficiently cooling semiconductor chips due to inadequate heat dissipation and stress management, particularly under temperature fluctuations, which affects the reliability and longevity of the modules.
Innovation Solution
The semiconductor module incorporates a cooling device with a top plate, side wall, and bottom plate that form a refrigerant circulating portion, featuring a slope portion and integrally configured cooling pin fins, which efficiently circulates refrigerant and manages thermal stress by overlapping the metal layer with the slope portion, enhancing heat dissipation and reducing plastic strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cooling device uses a conventional rectangular side wall configuration, then the structure is simple and easy to manufacture, but the heat dissipation efficiency is insufficient and thermal stress management is inadequate
Solution Approach 1:
The side wall is designed with an asymmetric configuration where one side includes an inclined surface while the other side remains substantially vertical. This asymmetric design optimizes the internal flow path of the cooling medium, enhancing heat dissipation efficiency without significantly increasing manufacturing complexity. The inclined surface creates a more effective cooling medium circulation pattern compared to a conventional symmetric rectangular design.
Solution Approach 2:
The cooling device applies different geometric characteristics to different regions of the side wall. Specifically, the first side wall element includes an inclined surface while the second side wall element maintains a substantially vertical configuration. This local differentiation allows the cooling structure to be optimized for heat dissipation in critical areas while maintaining simplicity in other regions, resolving the contradiction between performance and complexity.
2Reliability
If the metal layer is positioned without overlapping the side wall, then the circuit board assembly is simple, but thermal stress management is insufficient under temperature fluctuations
Solution Approach 1:
The design intentionally positions the metal layer to overlap with the inclined surface region of the side wall before thermal cycling occurs. This pre-positioning creates a stress distribution pattern that cushions against thermal expansion and contraction forces during temperature fluctuations, preventing solder joint failure and improving reliability without requiring complex real-time adjustments.
Solution Approach 2:
The metal layer positioning is designed to be asymmetric relative to the side wall, with intentional overlap in specific regions. This asymmetric positioning creates a more effective stress distribution pattern under thermal loading compared to a centered or non-overlapping configuration, enhancing thermal stress resistance while maintaining reasonable manufacturing precision requirements.
3Volume of moving object
If the cooling device uses a compact design, then the module size is reduced, but the refrigerant circulation path may be insufficient for effective cooling
Solution Approach 1:
The inclined surface in the side wall introduces a dimensional variation that optimizes the three-dimensional arrangement of cooling channels. This geometric feature allows the cooling medium to flow more effectively through the compact structure by creating pressure differentials and flow paths that would not exist in a conventional rectangular design, thereby maintaining cooling efficiency while reducing overall module volume.
Solution Approach 2:
The inclined surface creates a curved or angled flow path for the cooling medium, replacing straight linear paths with angled transitions. This curvature in the flow path improves fluid dynamics within the compact structure, enabling more effective heat removal despite the reduced size, thus resolving the contradiction between compactness and cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation efficiency and reduces thermal stress, enhancing the reliability and compactness of the semiconductor module while maintaining structural integrity under temperature variations.
Implementation Method 1
a cooling device (10) including a top plate (20) where the semiconductor device (70) is mounted
Implementation Method 2
a refrigerant circulating portion (92) for circulating a refrigerant, which is defined by the top plate (20), the side wall (36), and the bottom plate (64)
Data Source
AI summary
A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device includes a semiconductor chip and a circuit board for mounting the chip. The cooling device includes a top plate mounted in the semiconductor device and having a side wall connected thereto, a bottom plate connected to the side wall, and a refrigerant circulating portion, defined by the top plate, the side wall, and the bottom plate and has a substantially rectangular shape with a cross section parallel to a main surface of the top plate having long and short sides. The circuit board is a substantially rectangular laminated circuit board including an insulating plate having an upper surface with a circuit layer and a lower surface with a metal layer. In a plan view, at least one corner of the metal layer at least partially overlaps with the slope portion of the side wall.