Semiconductor Module Sealing Structure for Fin-to-Jacket Cooling Gaps
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Solution Overview
Problem
The clearance between heat dissipation fins and the water jacket in semiconductor devices leads to reduced cooling performance and corrosion due to increased water passage and potential differences, complicating assembly with separate sealing components.
Innovation Solution
A semiconductor module with a sealing material that integrates a sealing portion, bottom portion, and connection portions to cover the gaps between heat dissipation fins and the water jacket, enhancing cooling performance and preventing corrosion while simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a clearance is provided between the heat dissipation fins and the water jacket to avoid contact, then manufacturing reliability is improved, but cooling performance deteriorates and corrosion occurs
Solution Approach 1:
A sealing member is introduced as an intermediary component between the heat dissipation fins and the water jacket. This sealing member fills the clearance space, preventing cooling water from leaking into the clearance while maintaining the necessary gap to avoid direct contact between the fins and water jacket, thus preventing corrosion and maintaining cooling performance
Solution Approach 2:
The sealing member is designed as a flexible component that can adapt to the clearance space between the heat dissipation fins and the water jacket. This flexible sealing structure effectively blocks the clearance to prevent water infiltration and corrosion, while allowing for dimensional variations in manufacturing
2Manufacturing precision
If the clearance is increased to avoid contact between heat dissipation fins and water jacket, then manufacturing tolerance is improved, but cooling performance deteriorates
Solution Approach 1:
The sealing member acts as a mediator that allows larger clearances to be used without compromising cooling performance. It prevents cooling water from taking shortcuts through the clearance, ensuring that water flows through the heat dissipation fins as intended, thus maintaining cooling efficiency even with increased manufacturing tolerance
3Object-affected harmful factors
If a separate member for closing the clearance is disposed, then corrosion prevention is improved, but device complexity increases and assembly time increases
Solution Approach 1:
The sealing member is designed to integrate multiple functions into a single component. It combines the functions of sealing the clearance, preventing corrosion, and maintaining proper water flow paths. This merged structure eliminates the need for multiple separate components, simplifying the overall device structure and reducing assembly complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves cooling performance, prevents corrosion, and facilitates assembly by integrating the sealing material with the heat dissipation fins and water jacket, reducing assembly complexity and costs.
Implementation Method 1
a sealing material integrally includes a sealing portion in contact with a surface of the heat dissipation base of the cooler
Implementation Method 2
cooling water flows through a plurality of heat dissipation fins in a water jacket in order to cool a semiconductor element by heat dissipation
Data Source
AI summary
A semiconductor module includes a cooler including a heat dissipation base and a plurality of heat dissipation fins disposed on a lower surface of the hear dissipation base, a substrate disposed on an upper surface of the hear dissipation base, having a semiconductor element mounted thereon, a water jacket configured to allow cooling water to flow through the plurality of heat dissipation fins when attached to a lower surface side of the cooler, a sealing part disposed on the lower surface of the heat dissipation base. The sealing part has a shape of recess accommodating the heat dissipation fins, the sealing part integrally having a sealing portion in contact with the lower surface of the heat dissipation base and extending away from heat dissipation fins, a bottom portion facing tips of the heat dissipation fins, and a plurality of connection portions each connecting the sealing portion to the bottom portion.