Power Semiconductor Module with Integrated Cooling Plate Housing
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Solution Overview
Problem
Existing power semiconductor modules are cumbersome to assemble into a compact form and lack effective explosion protection, particularly in high-voltage and heavy-current applications, where bonding wires can melt and cause arcing, leading to safety hazards.
Innovation Solution
A power semiconductor module design where each unit's cooling plate forms the upper and lower housing walls, with mechanically stable insulating side walls and retaining rings providing explosion protection, and a simple busbar connection using terminals, allowing for a compact and cost-effective assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power semiconductor units are assembled using conventional methods with bonding wires, then electrical connections can be established, but the module becomes space-consuming and vulnerable to explosions in high-voltage applications
Solution Approach 1:
The housing walls are merged with the cooling plates into a single integrated component. The first and second housing walls are formed as extensions of the first and second cooling plates respectively, eliminating the need for separate housing structures and reducing assembly complexity while maintaining explosion protection
Solution Approach 2:
The cooling plates serve dual functions: they provide thermal management for the power semiconductor devices and simultaneously form the housing walls that provide mechanical support and explosion protection. This multi-functionality reduces the number of components needed in the module
2Ease of manufacture
If power semiconductor units are assembled using conventional methods, then electrical connections are established, but the assembly process becomes cumbersome and time-consuming
Solution Approach 1:
The housing walls are pre-formed as integral extensions of the cooling plates during manufacturing. This preliminary formation of the housing structure eliminates the need for separate housing assembly steps and reduces overall assembly time
Solution Approach 2:
By combining the housing walls and cooling plates into a single integrated component, the number of assembly steps is reduced. The power semiconductor units can be directly mounted on the cooling plate housing without requiring separate housing assembly operations
3Object-affected harmful factors
If conventional power semiconductor modules are used, then basic functionality is achieved, but they lack effective explosion protection in high-voltage applications
Solution Approach 1:
The cooling plates are designed to also serve as housing walls, providing both thermal management and mechanical explosion protection functions through a single component structure
Solution Approach 2:
The housing walls are merged with the cooling plates into a single integrated component. The first and second housing walls are formed as extensions of the first and second cooling plates respectively, eliminating the need for separate housing structures and reducing assembly complexity while maintaining explosion protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact, inexpensive module with enhanced explosion protection, preventing the spread of gases and absorbing explosion forces, thus ensuring safety in high-voltage applications.
Implementation Method 1
each power semiconductor unit being assigned a cooling plate to which the controllable power semiconductors are thermally connected
Implementation Method 2
the usually mechanically stable cooling plates serve as explosion protection
Data Source
Figure 1
Figure 2
AI summary
The invention relates to a power semiconductor module (1) comprising at least two power semiconductor units (11) that are interconnected and that have controllable semiconductors, every semiconductor unit (11) being associated with a cooling plate (3, 4) to which the semiconductors are connected in a heat-conducting manner. The aim of the invention is to provide a semiconductor module of the above type which is compact and cost-effective and at the same time explosion-proof. The power semiconductor module according to the invention is characterized by comprising a module housing (2) which houses the power semiconductor units (11), the cooling plates (3, 4) configuring at least part of the module housing.