Semiconductor Module Cooling Apparatus with Localized Plate Thickness
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Solution Overview
Problem
Conventional semiconductor modules with cooling fins face challenges in efficiently dissipating heat generated by power semiconductor chips while maintaining structural integrity and sealing properties, especially under strong fastening forces.
Innovation Solution
The semiconductor module incorporates a cooling apparatus with a top plate, side wall, and bottom plate design that includes a coolant flow portion with fins, where the top plate is thinner to enhance heat transfer and the side wall and bottom plate are thicker to improve rigidity, along with a resin structure for sealing and thermal connection, allowing for efficient heat dissipation without enlarging the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the top plate is made thinner to enhance heat transfer, then heat dissipation efficiency is improved, but structural strength deteriorates
Solution Approach 1:
The cooling apparatus employs different thicknesses for different parts: the top plate is made thinner (first thickness) to enhance heat transfer from semiconductor chips, while the bottom plate is made thicker (second thickness greater than first thickness) to provide structural support and rigidity. This local differentiation of thickness resolves the contradiction between heat dissipation efficiency and structural strength.
2Strength
If the side wall and bottom plate are made thicker to improve rigidity, then structural integrity is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
The cooling apparatus differentiates thickness locally: the bottom plate has a greater second thickness for structural integrity, while the top plate has a smaller first thickness for heat transfer. The side wall connects these plates and provides lateral support. This local differentiation allows each region to optimize for its primary function without compromising the other.
3Temperature
If cooling fins are added to increase heat dissipation surface area, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The cooling apparatus extends in the vertical dimension with the side wall having a height that creates a three-dimensional cooling structure. The top plate, bottom plate, and side wall form a volumetric cooling chamber that can contain coolant, utilizing the third dimension (height/depth) to enhance heat dissipation without adding horizontal complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively cools the semiconductor chips by optimizing the thickness and structure of the cooling apparatus components, enhancing heat dissipation efficiency and structural integrity, thereby preventing deformation and ensuring reliable operation under fastening forces.
Implementation Method 1
a coolant flow portion 92 defined by the top plate 20, the side wall 36 and the bottom plate 64
Implementation Method 2
the top plate 20 is thinner to enhance heat transfer
Implementation Method 3
a coolant flow portion 92 defined by the top plate 20, the side wall 36 and the bottom plate 64
Data Source
AI summary
Provided is a semiconductor module including semiconductor devices and a cooling apparatus, wherein the semiconductor device has semiconductor chips and a circuit board with the semiconductor chips implemented thereon; the cooling apparatus has a top plate, a side wall, a bottom plate, a coolant flow portion, an inlet, an outlet and a plurality of fins; the top plate and the bottom plate have three through holes that are through holes for inserting fastening members that fasten the semiconductor module to an external apparatus, penetrating the top plate and the bottom plate in one direction respectively; and a geometric center of gravity of a aperture of at least one of the inlet and the outlet may also be positioned inside a virtual triangle with the three through holes being vertexes in planar view.