Semiconductor Module Cooling Device with Segmented Thermal Paths
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Solution Overview
Problem
Conventional semiconductor modules experience low cooling efficiency due to heat generation by capacitors, which is not effectively dissipated, leading to thermal interference and reduced performance.
Innovation Solution
The semiconductor module incorporates a cooling device with a refrigerant circulation system and strategically arranged metal bodies and circuit boards to efficiently transfer heat from semiconductor chips and capacitors to cooling fins, enhancing thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a capacitor is connected to the input terminal of the semiconductor module, then the electrical function is improved, but heat generation increases and cooling efficiency decreases
Solution Approach 1:
The patent segments the heat dissipation system by providing separate cooling paths: one for the semiconductor element (through the semiconductor element cooling plate) and another for the capacitor (through the capacitor cooling plate). This segmentation allows each component to be cooled optimally according to its specific thermal characteristics, resolving the contradiction between maintaining electrical function and managing heat generation.
Solution Approach 2:
The patent introduces intermediary thermal conduction structures including thermal conduction members between the capacitor and capacitor cooling plate, and thermal conduction paste in the grooves. These intermediaries improve the thermal coupling between heat-generating components and cooling structures, enabling more effective heat transfer without compromising electrical connections.
2Temperature
If the circuit substrate area is increased to accommodate better heat dissipation structures, then cooling efficiency is improved, but the overall module size increases
Solution Approach 1:
The patent utilizes the vertical dimension by creating grooves that extend downward from the circuit substrate surface and filling them with thermal conduction paste. This three-dimensional heat dissipation approach allows improved thermal coupling without proportionally increasing the planar area of the circuit substrate, thus resolving the contradiction between cooling efficiency and module compactness.
Solution Approach 2:
The patent embeds the capacitor within the circuit substrate structure, with the capacitor cooling plate integrated into the substrate design. The capacitor is positioned in a recessed area, and the cooling structures are nested within the overall module footprint, allowing efficient heat dissipation without proportionally increasing the external dimensions.
3Temperature
If thermal conduction paste is filled in grooves to improve heat transfer, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent designs the grooves to be formed in advance during circuit substrate manufacturing, with predetermined shapes and locations. The thermal conduction paste is then simply filled into these pre-formed grooves, which simplifies the manufacturing process compared to creating complex three-dimensional heat dissipation structures after substrate fabrication. This preliminary structuring resolves the contradiction between heat transfer efficiency and manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves cooling efficiency, reducing the temperature increase of internal capacitors by 15% and allowing for potential downsizing and cost reduction of capacitor components.
Implementation Method 1
The semiconductor module incorporates a cooling device with a refrigerant circulation system and strategically arranged metal bodies and circuit boards to efficiently transfer heat from semiconductor chips and capacitors to cooling fins
Implementation Method 2
The cooling device may have a top plate including a front surface, and a back surface. The cooling device may have a refrigerant circulation portion arranged on the back surface of the top plate. The cooling device may have a cooling fin provided to extend from the back surface toward the refrigerant circulation portion.
Data Source
AI summary
A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device has: an input terminal; a wiring portion that includes a first end portion, and a second end portion, and extends in one direction, the first end portion being connected to the input terminal; a circuit substrate that includes a top surface, and a bottom surface, the top surface being provided with a first circuit board and a second circuit board along the one direction, the bottom surface being arranged on a top surface of the cooling device; a metal body connected between the wiring portion, and a top surface of the first circuit board; and a semiconductor chip that includes a top surface electrode, and a bottom surface electrode, the top surface electrode being connected to the second end portion, the bottom surface electrode being connected to a top surface of the second circuit board.