Semiconductor Module Circuit Layout for Corner Heat Suppression
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Solution Overview
Problem
The increased current rating in semiconductor modules, particularly with reverse-conducting IGBTs, leads to abnormal overheating due to higher heat generation, which was not a problem at lower current ratings, as a result of increased current density and positional deviations in current flow through the circuit pattern.
Innovation Solution
A semiconductor module circuit structure is designed with an insulating circuit substrate and semiconductor elements where the circuit pattern includes straight and corner parts, and wiring members are disposed off-center towards the outer circumference of these parts to divert current flow and reduce resistance, ensuring uniform heat distribution and preventing localized overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the current rating is increased in semiconductor modules, then the current capacity is improved, but abnormal overheating occurs due to higher heat generation and current density
Solution Approach 1:
The patent applies local quality by positioning wiring members at specific locations on the circuit pattern - specifically on straight parts extending from corner parts, with wiring members disposed off-center toward outer circumferential sides. This localized arrangement optimizes heat dissipation in high-current-density regions without requiring changes to the entire circuit structure, thereby suppressing abnormal overheating while maintaining high current rating
Solution Approach 2:
The patent addresses the two-dimensional heat distribution problem by introducing a strategic spatial dimension - positioning wiring members not just along the current path but specifically offset toward outer circumferential sides of corner parts. This dimensional adjustment creates more uniform current distribution across the circuit pattern area, reducing localized hot spots that cause overheating at high current ratings
2Temperature
If wiring members are disposed off-center toward outer circumferential side of corner parts, then heat distribution is uniform, but manufacturing complexity increases
Solution Approach 1:
The patent employs parameter changes by specifying precise positioning parameters for wiring members - their locations are defined by geometric relationships to corner parts (off-center toward outer circumferential sides). These parameterized positions can be directly specified in PCB design software and manufacturing data, enabling automated manufacturing processes to accommodate the non-standard positioning without significant complexity increases
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses abnormal overheating while maintaining or increasing the current rating, ensuring the semiconductor module operates efficiently and reliably.
Implementation Method 1
a wiring member that follows the extension direction of the straight part is disposed off-center toward an outer circumferential side of the corner part
Data Source
AI summary
A semiconductor module circuit structure, including an insulating circuit substrate having an insulating plate, and a circuit pattern formed on a top face of the insulating plate, and a semiconductor element disposed on a top face of the circuit pattern. The circuit pattern includes a first straight part extending in a first direction, a second straight part extending in a second direction different from the first direction, and a corner part connecting the first and second straight parts. A wiring member is formed on a top surface of the first straight part along the first direction, the wiring member being formed off-center at the first straight part to be closer to an outer periphery of the circuit pattern.